Adhesion material and circuit connection method


Application Number  00128606 Application Date  2000.08.19
Publication Number  1296053 Publication Date  2001.05.23
Priority Information   1999/8/19 JP 233300/99  
International
Classification
 C09J9/02;C09J163/00;C09J187/00  
Applicant(s) Name  Sony Corp.  
Address    
Inventor(s) Name  Takeichi Genshu;Shinsaki Urunji  
Patent Agency Code  72001 Patent Agent  liu yuanjin
AbstractAn adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m<2>/g) satisfies Equation below, their mean particle size D1 ( mu m) and maximum particle size D2 ( mu m) respectively satisfy Equations, D1 </= 5 and D2 = 0.5 (h1 + h2) (wherein h1 represents the height of the protuberant electrode in the electronic component, and h2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.