Adhesive for additional resin layers of circuit board


Application Number: 00109266
Application Date: 2000.06.14
Publication Number: 1328105
Publication Date: 2001.12.26
Priority Information:
International: C09J201/00
Applicant(s) Name: Hezheng Science and Technology Co Ltd
Address:
Inventor(s) Name: Ye Yunzhao
Patent Agency Code: 11021
Patent Agent: zhu liguang
Abstract An adhesive for the laminated circuit board is prepared from solidifying resin, dimethyl formamide, propanediol methylether diacyanamine, 2-methyl imidazole and phenoxy resin through uniform mixing. Its advantages are easy control of thin core thickness, good uniformity, less shear stress and low cost.