Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated


Application Number: 00108762
Application Date: 1995.08.29
Publication Number: 1284520
Publication Date: 2001.02.21
Priority Information: 1995/1/30 JP 012437/1995; 1995/2/2 JP 016183/1995; 1994/8/30 JP 205175/1994; 1994/9/27 JP 231182/1994
International: C08K5/138;C08L63/00
Applicant(s) Name: Sumitomo Chemical Co., Ltd.
Address:
Inventor(s) Name: Ageta Yoichi;Endo Yasuhiro;Shibata Mitsuhiro
Patent Agency Code: 11038
Patent Agent: chen jizhuang
Abstract The invention relates to an aryl ester compound, which is used as a curing agent for an epoxy resin and has a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising the compound; and multilayer produced by the epoxy resin.