Binding compsns.

Application Number: 00108541
Application Date: 2000.05.12
Publication Number: 1273809
Publication Date: 2000.11.22
Priority Information: 1999/5/13 JP 132085/99
International: A61K6/00;C09J201/00
Applicant(s) Name: Kuraray Co., Ltd.
Inventor(s) Name: Hino Kenichi
Patent Agency Code: 72001
Patent Agent: liu yuanjin
Abstract Provided is a bonding composition which, not requiring any pre-treatment such as acid-etching treatment or priming treatment, exhibits high initial bonding strength and good bonding durability. It comprises a mixture of an acid group-having polymerizable compound, a water-soluble film-forming agent, water, and a curing agent, in which the calcium salt of the acid is insoluble in water, and the film-forming agent is a polymerizable compound and is miscible with a physiological saline solution.