Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly


Application Number  00128333 Application Date  2000.11.24
Publication Number  1300180 Publication Date  2001.06.20
Priority Information   1999/11/24 JP 333409/1999  
International
Classification
 G06K19/07;H05K3/00;H05K3/30  
Applicant(s) Name  Omron Corp.  
Address    
Inventor(s) Name  Kawai Wakato  
Patent Agency Code  11038 Patent Agent  wang yonggang
AbstractThe present invention is to quickly and electrically and mechanically reliably provide a method of mounting a semiconductor chip on a wiring board at a low cost, in a mountable flip-chip connection system. This mounting method comprises a step of pressing bumps of a semiconductor bare chip onto a thermoplastic resin film which is in a molten state in the condition of heating the thermoplastic resin film covering electrode regions on a wiring pattern with application of ultrasonic waves, thereby pushing the molten thermoplastic resin film aside to cause the bumps to contact the electrode regions, a step of successively applying ultrasonic waves to ultrasonically bond the bumps to the electrode regions in the condition of the bumps contacted to the electrode regions, and a step of cooling and hardening the molten thermoplastic resin to adhere the semiconductor bare chip to the wiring board.