| Application Number | 00128333 | Application Date | 2000.11.24 |
| Publication Number | 1300180 | Publication Date | 2001.06.20 |
| Priority Information | 1999/11/24 JP 333409/1999 | ||
| International Classification |
G06K19/07;H05K3/00;H05K3/30 | ||
| Applicant(s) Name | Omron Corp. | ||
| Address | |||
| Inventor(s) Name | Kawai Wakato | ||
| Patent Agency Code | 11038 | Patent Agent | wang yonggang |
| AbstractThe present invention is to quickly and electrically and mechanically reliably provide a method of mounting a semiconductor chip on a wiring board at a low cost, in a mountable flip-chip connection system. This mounting method comprises a step of pressing bumps of a semiconductor bare chip onto a thermoplastic resin film which is in a molten state in the condition of heating the thermoplastic resin film covering electrode regions on a wiring pattern with application of ultrasonic waves, thereby pushing the molten thermoplastic resin film aside to cause the bumps to contact the electrode regions, a step of successively applying ultrasonic waves to ultrasonically bond the bumps to the electrode regions in the condition of the bumps contacted to the electrode regions, and a step of cooling and hardening the molten thermoplastic resin to adhere the semiconductor bare chip to the wiring board. | |||