Conductive cap, electronic assembly and method for forming insulation film of conductive cap


Application Number: 00126232
Application Date: 2000.08.18
Publication Number: 1285656
Publication Date: 2001.02.28
Priority Information: 1999/8/18 JP 231988/99; 1999/8/18 JP 231989/99; 1999/10/7 JP 287217/99
International: H01L23/02;H03H9/02;H05K5/03
Applicant(s) Name: Murata Manufacturing Co., Ltd.
Address:
Inventor(s) Name: Umaba Shunyuki;Nishimura Shuno;Kitamura Goshi
Patent Agency Code: 31100
Patent Agent: shen zhaokun
Abstract A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.