Electrolytic copper electroplating liquid


Application Number: 00108550
Application Date: 2000.05.16
Publication Number: 1274021
Publication Date: 2000.11.22
Priority Information: 1999/5/17 US 09/313,045
International: C25D3/38
Applicant(s) Name: sypuri Inc.
Address:
Inventor(s) Name: L. R. Balstad;J. E. Rickvalski;M. Laifibufri
Patent Agency Code: 11038
Patent Agent: chen jizhuang
Abstract The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.