Electronic element with coil


Application Number  00129522 Application Date  2000.09.30
Publication Number  1290948 Publication Date  2001.04.11
Priority Information   1999/9/30 JP 279077/1999  
International
Classification
 H01F27/29  
Applicant(s) Name  Murata Manufacturing Co., Ltd.  
Address    
Inventor(s) Name  Mukai Takanori;Morinaga Tetsuya  
Patent Agency Code  11021 Patent Agent  zhu haibei
AbstractAn electronic component is constructed to prevent Cu elution to a solder from a wire, and also prevents the wire from becoming thin and being broken. A chip coil includes electrodes provided at both ends of a core. The electrodes include an underlying metal layer (Ag), a Ni plated layer, and a Sn-Cu plated layer arranged in this sequence from the bottom thereof. Ends of a wire are embedded in the Sn-Cu plated layer of the electrodes by thermal compression bonding. When the chip coil is mounted on a land of a substrate by a reflow soldering, the Cu of the Sn-Cu plated layer is eluted into the reflow solder, and Cu elution from the wire is prevented.