Electronic element


Application Number: 00105341
Application Date: 2000.03.31
Publication Number: 1269638
Publication Date: 2000.10.11
Priority Information: 1999/4/1 JP 95000/99
International: H03H9/25
Applicant(s) Name: Murata Mfg. Co., Ltd.
Address:
Inventor(s) Name: Shitakawa Ichinobu
Patent Agency Code: 31100
Patent Agent: li ling
Abstract An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bump(s) located along the peripheral portion of the electronic component element have a greater height than that of the bump(s) located at the central portion of the electronic component element.