Electronic equipment cooling member


Application Number: 00108371
Application Date: 2000.05.12
Publication Number: 1274258
Publication Date: 2000.11.22
Priority Information: 1999/5/12 JP 130910/99
International: H05K7/20
Applicant(s) Name: Matsushita Electric Industrial Co., Ltd.
Address:
Inventor(s) Name: Maehara Kenichi
Patent Agency Code: 31100
Patent Agent: liu libeng
Abstract Accumulation of heat in the electronic appliance is prevented, and the electronic appliance is cooled efficiently. Not requiring extra molded part as duct, the cost is saved. The noise level is lowered. This is a cooling structure for an electronic appliance having heat generating parts (7). The cooling structure includes a housing (20) having a top panel (1), side panels, and a bottom panel (5), a case (3) disposed in the housing, a circuit board (6) disposed in the case, and a frame (2) disposed in the space between the top panel and case. The circuit board has the heat generating parts. The space enclosed by the top panel, case and frame forms a wind tunnel (21). The heat generated in the heat generating parts is exhausted outside of the housing by the air passing through the wind tunnel. The case and the circuit board have the circuit board disposed in the housing, and a shield case (3) disposed to cover the circuit board.