Electroplating method and the used liquid front body


Application Number: 00108886
Application Date: 2000.04.06
Publication Number: 1275636
Publication Date: 2000.12.06
Priority Information: 2000/2/7 JP 029349/2000; 1999/4/6 JP 98996/99
International: C23C18/52
Applicant(s) Name: Daiwa Kasei Kogyo K. K.
Address:
Inventor(s) Name: Obata Keigo;Kim Tong-Hyon;Takeuchi Takao
Patent Agency Code: 11105
Patent Agent: wu xiaonan
Abstract To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.