Epoxy resin/microparticle composite solidified microsphere water base system and its preparation method

Application Number: 00107215
Application Date: 2000.04.28
Publication Number: 1321697
Publication Date: 2001.11.14
Priority Information:
International: C08J3/03;C08L63/04
Applicant(s) Name: Inst. of Chemistry, Chinese Academy of Sciences
Inventor(s) Name: Yang Zhenzhong;Zhu Yan;Xu Jianjun
Patent Agency Code: 00000
Patent Agent:
Abstract The present invention relates to an epoxy resin/particle composite solidification microsphere water base system, in the system the weight ratio of epoxy resin/particle composite microsphere and water is 1:4-7:3, in which the grain size of expoxy resin/particle composite microsphere is 10 to the power 2 nm-10 to the powder 1 micrometer. The invented preparation method includes the following steps: uniformly stirring epoxy resin, inorganic particle and emulsifier according to the weight ratio of 10-99.8:0.1-44:0.1-50, making solidification reaction for 1-10 hr. so as to obtain the invented product with features of high strength and good heat-resisting property. Said invented product can be used as reinforcer and macromolecular modifier.