Etching and cleaning method and using equipment for etching and cleaning


Application Number: 00102991
Application Date: 2000.03.14
Publication Number: 1267904
Publication Date: 2000.09.27
Priority Information: 1999/3/15 JP 068898/1999
International: B08B3/02;C23F1/08;H01L21/304
Applicant(s) Name: NEC Corp.
Address:
Inventor(s) Name: Yamazaki Shinya;Aoki Hidemitsuru
Patent Agency Code: 11021
Patent Agent: rong zhimin
Abstract An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means for holding a semiconductor wafer and for rotating the wafer in a horizontal plane; the wafer having a device area and a surface peripheral area on its surface; the surface peripheral area being located outside the device area; and (b) an edge nozzle for emitting an etching/cleaning liquid toward a surface peripheral area of the wafer.