Fine electrospark process of forming electrode


Application Number: 00121477
Application Date: 2000.07.25
Publication Number: 1335659
Publication Date: 2002.02.13
Priority Information:
International: G03F7/00;H01T21/00
Applicant(s) Name: Inst. of High-Energy Physics, Academia Sinica
Address:
Inventor(s) Name: Peng Liangqiang;Yi Futing;Zhang Jufang
Patent Agency Code: 11021
Patent Agent: tang baobeng
Abstract The fine electrode forming electrospark process includes the steps of: applying one layer of millimeter or submillimeter level photoetching glue to a conducting base; exposure under mask; developing to obtain glue structure; electroplating metal or alloy onto the glue structure; and eliminating glue.