Flexible printing wiring substrate, electrooptics arrangement, and electronic device


Application Number: 00108385
Application Date: 2000.03.25
Publication Number: 1268675
Publication Date: 2000.10.04
Priority Information: 2000/1/31 JP 21607/00; 2000/1/31 JP 22890/00; 1999/3/26 JP 84770/99
International: G02F1/133
Applicant(s) Name: Seiko Epson Corp.
Address:
Inventor(s) Name: Endo Koo;Oishi Eiji;Ariga Yasuto
Patent Agency Code: 72001
Patent Agent: jiang fuhou
Abstract Connection terminals connected to a scanning driver IC chip 32 are arranged on a short side of a wiring connection area 25A of a second substrate 25 in a liquid crystal display panel 21, and the connection terminals and connection terminals arranged on a long side of a wiring connection area 24A of a first substrate 24 are connected from the same direction with a single flexible printed wiring board 22. For this reason, convenience of the flexible printed wiring board 22 can be improved. In addition, it is possible to reduce the projection size of the wiring connection area of the first substrate 24, and the ratio of the display area in the whole liquid crystal panel 21 can be increased.