Full-integrated hot ink-jet print head with laminated film


Application Number: 00108717
Application Date: 2000.05.26
Publication Number: 1286167
Publication Date: 2001.03.07
Priority Information: 1999/8/27 US 09/384817
International: B41J2/14
Applicant(s) Name: Hewlett-Packarad Co.
Address:
Inventor(s) Name: N.A. Kavamura;C.C. Davies;T.L. Weber
Patent Agency Code: 72001
Patent Agent: cai minjun
Abstract Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24), are formed on a top surface of a silicon substrate (20). The various layers are etched to provide conductive leads (25) to the ink ejection elements (24). At least one ink feed hole (26) is formed through the thin film layers for each ink ejection chamber (30). A trench (36) is etched in the bottom surface of the substrate (20) so that ink (38) can flow into the trench. The trench completely etches away portions of the substrate near the ink feed holes so that the thin film layers form a shelf in the vicinity of the ink feed holes.