Heat sink and its manufacture


Application Number: 00109463
Application Date: 2000.06.26
Publication Number: 1332475
Publication Date: 2002.01.23
Priority Information:
International: F28F3/00;G06F1/20;H01L23/36;H05K7/20
Applicant(s) Name: Zhiling Co., Ltd.
Address:
Inventor(s) Name: Chen Mingfeng
Patent Agency Code: 11021
Patent Agent: tang baobeng
Abstract The heat sink for chip is manufactured by plating metal layer of copper material and nickel material on heat dissipating pin and base plate of aluminium material, welding the heat dissipating pins and the base plate in an integral heat sink with high heat dissipating efficiency.