Hot-dip tinplating filling process for plate piece joint of plate type combination compound

Application Number: 00107221
Application Date: 2000.04.28
Publication Number: 1321789
Publication Date: 2001.11.14
Priority Information:
International: B23K1/08;C23C2/08
Applicant(s) Name: Cai Zhenfa
Address:
Inventor(s) Name: Cai Zhenfa
Patent Agency Code: 11021
Patent Agent: tang baobeng
Abstract The hot-dip tinplating fill-up method of joint seam of plates of die-cut plate type assembling unit mainly includes the following steps: continuously water-washing and acid-washing die-cut plate type assemblying unit to be plated so as to remove dirt and rusty stain from surface of material to be plated, impregnating with scaling agent, then impregnating with molten tin, then continuously centrifugalizing, vibrating and rotating to remove excess tin liquor and make the tin liquor uniformly distributed over the surface of assembly unit, then cooling and drying so as to can implement said invention.