IC packing stacked module


Application Number: 00107649
Application Date: 2000.05.17
Publication Number: 1324110
Publication Date: 2001.11.28
Priority Information:
International: H01L21/50;H01L21/98;H01L25/065
Applicant(s) Name: Huatai Electronics Co., Ltd.
Address:
Inventor(s) Name: Xie Wenle;Zhuang Yongcheng;Huang Ning
Patent Agency Code: 11127
Patent Agent: cao ansheng
Abstract A pile up model set for integrated circuit packaging includes at least one layer of backing base which has at least one pair of intergrated circuit crystal plate and coated with sealing glue.