Laser imaging of thin film circuit material


Application Number  00128400 Application Date  2000.10.13
Publication Number  1321060 Publication Date  2001.11.07
Priority Information   1999/10/13 US 09/418,207  
International
Classification
 H05K3/02  
Applicant(s) Name  Morton International, Inc.  
Address    
Inventor(s) Name  W.E. Nacler;R.W. Carpenter  
Patent Agency Code  11038 Patent Agent  duan chengen
AbstractThe invention provides a laser imaging method of a thin film electronic circuuit material. For forming thin film electronic constituent components, a thin film having desired electric characteristics is deposited on a layer consisting of different materials. Heat energy from a computer guided laser device is used fror removing selected parts of the thin film. In one aspect, the thin film is an electrically conductive material such as platinum or doped platinum, and the base body of the thin film is a metal foil such as a copper foil. The heat energy from the device laser removes parts of the thin film. In another aspect, a layer of zero valence metal is deposited on a dielectric material base and the dielectric material base has a melting point or decomposition temperature substantially above that of the zero valence metal. The zero valence metal layer is patterned by the computer guided laser beam to form electronic circuit constituent parts.