LGA clamping mechanism

Application Number: 00107803
Application Date: 2000.06.12
Publication Number: 1277459
Publication Date: 2000.12.20
Priority Information: 1999/6/11 US 09/330402
International: H01L23/00;H01L23/34;H05K7/20
Applicant(s) Name: Thomas-Betz International Inc.
Inventor(s) Name: Jonathan W. Goodwin
Patent Agency Code: 72002
Patent Agent: cheng kun
Abstract A Land Grid Array (LGA) clamp mechanism includes a spring assembly comprising a spring and a bias adjustment screw, the spring has a number of beams that mate with cooperating posts from a backing plate. The backing plate fits on the bottom side of a printed circuit board, posts pass through the printed circuit board. The LGA device is either inserted into a socket on the top side of the printed circuit board or mounted directly to the top side of the printed circuit board. A heat sink is placed directly on top of the LGA device. The posts extend through the circuit board and through the heatsink. A spring assembly is positioned along the heatsink and is secured to the posts. The screw is adjusted to provide a desired uniform amount of pressure to the heatsink, device and socket. Such a mechanism not only provides a uniform amount of pressure but also is additionally simple to install and adjust.