Manufacture of semiconductor device

Application Number: 00104993
Application Date: 2000.04.07
Publication Number: 1270416
Publication Date: 2000.10.18
Priority Information: 1999/4/8 JP 101346/1999
International: H01L21/48;H01L21/60;H01L23/544
Applicant(s) Name: Hitachi Ltd.
Inventor(s) Name: Miyamoto Toshio;Tanaka Eiki;Nishimura Asao
Patent Agency Code: 11038
Patent Agent: wang yonggang
Abstract In the manufacturing process of the semiconductor device, on the surface of the back of the semiconductor wafer, it provides a process for forming labels on the back area of the semiconductor wafer corresponding to the forming areas for each die, respectively, which is after the process of forming a plurality of die forming areas with circuits thereon and before the process of forming the protruded electrodes on the forming areas for each die.