Manufacture of wire holder in double electroplating mold


Application Number: 00108599
Application Date: 2000.05.18
Publication Number: 1325138
Publication Date: 2001.12.05
Priority Information:
International: C25D7/00;H01L21/02;H01L23/495
Applicant(s) Name: Shunde Industry Co., Ltd.
Address:
Inventor(s) Name: Chen Chaoliang
Patent Agency Code: 31100
Patent Agent: sha yongsheng
Abstract The production method of wire guide frame for dual electroplating mould, in particular, the production method of a layer of tape wire-guiding frame for integrated circuit is characterized by utilizing front and back placed two groups of moulds, and controlling conveyance stop and time of conveyer and simultaneously and synchronously implementing two-stage operations of electroplating and recovering silver to save production time, save production cost and raise production efficiency.