Mat under printed circuit board, and its processing art


Application Number: 00108481
Application Date: 2000.06.09
Publication Number: 1277917
Publication Date: 2000.12.27
Priority Information:
International: B32B15/14;H05K1/03
Applicant(s) Name: Zhao Xishui
Address:
Inventor(s) Name: Zhao Xishui
Patent Agency Code: 13100
Patent Agent: wang yuxiang
Abstract The present invention relates to an improvement of the structural design and mfg. technology of printed circuit board backing plate, its structure adopts medium or high density core plate and adhered with metal foil on both surfaces. A new technology of coating glue on both surfaces and pressurized at a certain temperature for curing simplifies the process and meets the technical requirement of printed circuit board.