Matched-mold forming device for producing resin product


Application Number: 00108361
Application Date: 2000.03.24
Publication Number: 1273167
Publication Date: 2000.11.15
Priority Information: 1999/3/24 JP 79750/99; 1999/3/24 JP 79751/99; 1999/3/24 JP 79752/99
International: B29C45/00
Applicant(s) Name: Honda Lock Manufacturing Co.,Ltd.
Address:
Inventor(s) Name: Niinazuku Keiya;Yoshii Kyotaro;Iue Junichi
Patent Agency Code: 72001
Patent Agent: lin changan
Abstract In a die molding apparatus for molding resin articles having a plurality of molds for forming a cavity in communication with an injection gate and a gas charging nozzle capable of charging the inside of the cavity with a gas after the completion of resin injection to form a resin article having a hollow inside, an overflow portion for relieving an excess molten resin and a film gate for communication between the main cavity portion and the overflow portion are formed between a pair of molds forming the other end of the cavity, and the gap between both of molds is set to 1.5 mm or less at the film gate; the gas charging nozzle is situated in the cavity with a gas charging hole being positioned in the cavity; and a hole-sealed hollow cylinder is formed between one of molds and the gas charging nozzle, the hole-sealed hollow cylinder having an inner surface shape defined by the outer surface of the cylindrical small diameter portion and the step and an outer surface shape defined by the inner surface of the insertion hole of the gas charging nozzle provided the cavity.