Method and equipment for reducing non-uniform area influence in semiconductor device production


Application Number: 00108237
Application Date: 2000.04.30
Publication Number: 1280384
Publication Date: 2001.01.17
Priority Information: 1999/4/30 US 09/302392
International: G03F7/00;H01L21/027
Applicant(s) Name: Infineon Tech. North America Corp.
Address:
Inventor(s) Name: S.Schlze;F.Zhak
Patent Agency Code: 72001
Patent Agent: liang yong
Abstract The non-uniformity edge effect that can affect the quality of chips near the edge of a semiconductor wafer of various steps in the manufacture of integrated circuits is reduced. This is achieved by increasing the field area exposed by a step and repeat printer only when printing squares for chips located near the wafer edge. As a result there is also printed for processing an additional non-functional area outside the functional area to reduce the non-uniformity effect. This increases throughput of the printing apparatus.