Method for making double-metal inlaid structure


Application Number  00128994 Application Date  2000.09.25
Publication Number  1346148 Publication Date  2002.04.24
Priority Information    
International
Classification
 H01L21/28;H01L21/463;H01L21/768  
Applicant(s) Name  Lianhua Electronic Co., Ltd.  
Address    
Inventor(s) Name  Cai Tengqun;Chen Xuezhong;Yang Mingsheng  
Patent Agency Code  11105 Patent Agent  tao fengbei
AbstractThe method for making double metal inlaid structure includes the following steps: providing a substrate, forming an insulating layer on the substrate, in the insulating layer possessing a double metal inlaid type opening, in said opening covering with lining layer, metal layer and a layer of top cover layer, using metal layer lapping liquid or top cover layer lapping liquid to make chemical mechanical abrasion of top coer layer, lapping top cover layer over and outside the double metal inlaid type opening until the metal layer is exposed, remaining top cover layer over the opening and protecting metal layer over the opening, and lapping the metal layer outside the opening until the lining layer is exposed, removing the lining layer so as to form a slightly-projected metal conductor structure.