Method for manufacture of head suspended assembly body with IC chip


Application Number: 00108956
Application Date: 2000.05.24
Publication Number: 1274908
Publication Date: 2000.11.29
Priority Information: 1999/5/24 JP 143414/1999
International: G11B5/127;G11B21/16
Applicant(s) Name: TDK Corp.
Address:
Inventor(s) Name: Shiriashi Kazumasa;Nigita Katsu;Kaai Mitsuyoshi
Patent Agency Code: 11038
Patent Agent: zheng zhongjun
Abstract A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.