Method for preparation of printed IC board


Application Number: 00125299
Application Date: 2000.09.21
Publication Number: 1285614
Publication Date: 2001.02.28
Priority Information:
International: H01L21/48;H01L21/60;H05K3/00
Applicant(s) Name: Shanghai Jiaotong Univ.
Address:
Inventor(s) Name: Gu Mingyuan;Jin Yanping;Li Geyang
Patent Agency Code: 31201
Patent Agent: mao cuiying
Abstract The preparation method of printed integrated circuit board is charaterized by using low-expansion high thermal conductivity Al/Sic composite material as radiating base plate, using sputter process to directly plate the ceramic base plate material on the radiating base plate; using Ni-P plated layer to solve defect problem of Al/Sic surface, and adopting Al/Al2O3 or Al/AlN gradient structure layer to solve the combination force of plated layer and radiating base plate. Said invention integrates the high-power integrated circuit base plate and radiating base plate into one body, and reduces volume, simplifies production process and raises the reliability of electronic circuit, etc.