Method of depositing film on substrate surface and substrate made by said method


Application Number: 00108625
Application Date: 2000.04.22
Publication Number: 1271784
Publication Date: 2000.11.01
Priority Information: 1999/4/23 JP 116608/99; 2000/2/15 JP 36550/00
International: C23C14/06;C23C14/40
Applicant(s) Name: Nippon Sheet Glass Co., Ltd.
Address:
Inventor(s) Name: Anzaki Toshiaki;Ogino Etsuo;Tajima Takayuki
Patent Agency Code: 11105
Patent Agent: fan menge
Abstract A method of film deposition is disclosed, which eliminates the conventional problem that a coating film having a component concentration gradient in the thickness direction and thus having a boundary with a compositional gradient or a coating film in which two or more components coexist as a mixture thereof cannot be stably obtained by sputtering. In the method, two planar cathodes are closely arranged as a pair, and a voltage is applied thereto while alternately inverting the polarities thereof so that when a target A bonded to one of the cathodes is used as a negative electrode, then a target B bonded to the other cathode and differing to the target A in component is used as a positive electrode. The targets A and B are simultaneously bombarded with positive ions while passing a substrate in front of the targets so as to cross the cathodes. Thus, a coating film having a boundary with a compositional gradient in the thickness direction or a coating film having a two-layer structure composed of a layer of ingredient A and a layer of ingredient B is deposited by sputtering through one-direction conveyance.