Method of mfg. carrying band and carrying band type semiconductor device

Application Number: 00108568
Application Date: 2000.05.15
Publication Number: 1274173
Publication Date: 2000.11.22
Priority Information: 1999/5/14 JP 134529/99
International: H01L23/48;H01L23/12;H01L21/60
Applicant(s) Name: Sharp K. K.
Inventor(s) Name: Senkawa Yasunori
Patent Agency Code: 72001
Patent Agent: yang kai
Abstract In a COF manufactured by bonding and mounting a semiconductor element onto a wiring pattern on a lengthy tape carrier, the wiring patterns are aligned in more than one direction with respect to a direction in which the tape carrier is fed in a layout such that increases a utilized area of the tape carrier (in other words, such that reduces useless areas). Consequently, the number of the tape carrier type semiconductor devices manufactured out of a tape carrier of a certain length can be increased without losing benefits that they can be designed in an arbitrary shape, thereby saving the manufacturing cost.