Multichip installation structure, electrooptical device and electronic machine


Application Number: 00108797
Application Date: 2000.06.01
Publication Number: 1276587
Publication Date: 2000.12.13
Priority Information: 1999/6/2 JP 155234/99
International: H01L25/00
Applicant(s) Name: Seiko Epson Corp.
Address:
Inventor(s) Name: Uchiyama Kenji
Patent Agency Code: 72001
Patent Agent: jiang fuhou
Abstract A multichip mounted structure has a substrate 11 provided with substrate-side terminals 16a and 16b and a plurality of IC chips 12a and 12b provided with bumps 14a and 14b, respectively, so that the substrate-side terminals 16a and 16b are conductively connected with the bumps 14a and 14b, respectively. The bumps 14a and 14b provided on the plurality of IC chips 12a and 12b, respectively, form pairs of terminal lines opposing each other. Since the plurality of IC chips 12a and 12b are mounted on the substrate 11 so that central lines L1 and L2 between the pairs of terminal lines which are individually formed approximately coincide with each other, it is not necessary to transport a position of a compressive head, and one piece of ACF 19 can be commonly used.