Multilayer printing distribution board and its making method


Application Number  00128989 Application Date  2000.08.16
Publication Number  1291858 Publication Date  2001.04.18
Priority Information   1999/8/16 JP 229900/99  
International
Classification
 H05K1/00;H05K3/46  
Applicant(s) Name  Sony Corp.  
Address    
Inventor(s) Name  Watanable Yoshio;Anta Nobuyuki;Mihono Hironori  
Patent Agency Code  72001 Patent Agent  lin changan
AbstractThe invention provides a high-density multilayer printed wiring board and a method for manufacturing a multilayer printed wiring board having high-density wiring that is formed easily. A method for manufacturing a multilayer printed wiring board formed by laminating a plurality of laminates comprises a step for forming a conduction hole on a laminate comprising an insulating board having both sides on which conductive films are formed, a step for electrically connecting between both sides of said laminate through the above-mentioned conduction hole and planarizing the surface, a step for patterning the above-mentioned conductive film desiredly and forming a projection member at a desired position of the above-mentioned conductive film, a step for laminating bonding members having a through hole to which the above-mentioned projection member is inserted, which is served for bonding between the above-mentioned laminates, and the above-mentioned laminates alternately with insertion of the above-mentioned projection member into the above-mentioned throughhole, and a step for press-molding the above-mentioned laminated laminates and bonding members with heating.