Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide

Application Number: 00108814
Application Date: 2000.05.10
Publication Number: 1270979
Publication Date: 2000.10.25
Priority Information:
International: C08K9/02;C08L63/00;C09K3/10
Applicant(s) Name: Jilin Univ.
Inventor(s) Name: Fang Kun;Zhao Yi;Huang Jinsong
Patent Agency Code: 22201
Patent Agent: zhang jinglin
Abstract The present invention relates to a room temperature cured single-component organic silicon/epoxy resin encapsulating material after being activization-treated and modified with nanometer SiO2-x. The said encapsulating material contains modifier 0.3-4.5%, hexyl silicate as cross-linking agent 2.1-2.3%, low-molecular weight polyethylene wax and/or phthalate as plasticizer 1.4-1.7%, white carbon black as reinforcing agent 0-0.4% and assistant 0.1-0.3%. With the features of simple preparation process, room temperature curing, and short curing period, the encapsulating material may be used for encapsulating electronic and electric devices such as organic electroluminescent device (OELD), etc.