Printed circuit board and its mfg. method


Application Number: 00107571
Application Date: 2000.05.16
Publication Number: 1274256
Publication Date: 2000.11.22
Priority Information: 1999/5/18 KR 17733/99
International: H05K3/42;H05K3/46
Applicant(s) Name: Samsung Electronics Co., Ltd.
Address:
Inventor(s) Name: Park Gon-Yang;Kim Hong-Jik;Lee Yong-sam
Patent Agency Code: 11219
Patent Agent: xie lina
Abstract A printed circuit board and a manufacturing method therefor are disclosed. The method for manufacturing the printed circuit board includes the following steps. A first insulating layer is formed, and then the first metal layer is etched to form a circuit. A second insulating layer is stacked on one face of the first insulating layer, with a second metal layer formed on the second insulating layer. The second metal layer is etched by applying a photo lithography process to form a circuit and to form at least a first open region. With the same method, a third insulating layer is stacked on the second insulating layer and forming at least a second open region above the first open region. The first open region of the second insulating layer and the second open region of the third insulating layer are etched by using a CO2 laser to form a via hole. The via hole is coated with a metal to connect the circuit of the second insulating layer and the circuit of the third insulating layer together.