Probe adapter for spherical grid array component

Application Number: 00108718
Application Date: 2000.05.26
Publication Number: 1275719
Publication Date: 2000.12.06
Priority Information: 1999/5/28 US 09/322506
International: G01R1/067;G01R31/26;H01L21/66
Applicant(s) Name: Tectlanic Corp.
Inventor(s) Name: J. A. Kanbel;R. A. Zandonadi
Patent Agency Code: 72001
Patent Agent: xiao chunjing
Abstract A probing adapter for Ball-Grid-Array packages has an elongate body with a centrally disposed slotted region formed therein containing a slider that is movable within the slotted region. An electrically conductive plunger is attached to the slider and electrically coupled to an electrical contact exposed outside of the probe body. An electrode extends from the plunger and through an aperture formed in one end of the probe body to expose a hooked-shaped contact for making electrical contact with a solder ball contact of the ball grid assay package.