Process for preparing bimetal band with steel substrate

Application Number: 00110680
Application Date: 2000.07.19
Publication Number: 1334357
Publication Date: 2002.02.06
Priority Information:
International: B32B15/01;C23C4/08;C23C4/14;C23C4/18
Applicant(s) Name: Shenyang Inst of Metals Research, Chinese Academy of Sciences
Inventor(s) Name: Zhang Yongchang;Xie Zanhua;Wang Guopzhi
Patent Agency Code: 21002
Patent Agent: zhang chen
Abstract A bimetal band with steel substrate is made up through melting the alloy to be compounded, sufficiently breaking and atomizing by high-pressure gas, fast cooling, depositing the semi-liquid atomized stream onto continuously moving steel band, and rolling. Its advantages are high adhesion and compactness, and low cost.