Semi-solid connecting material, and its preparation and connecting method

Application Number: 00107491
Application Date: 2000.05.19
Publication Number: 1272474
Publication Date: 2000.11.08
Priority Information:
International: C04B37/00
Applicant(s) Name: Qinghua Univ.
Inventor(s) Name: Wu Aiping;Zou Guisheng;Ren Jialie
Patent Agency Code: 11201
Patent Agent: liao yuanqiu
Abstract A preparation method of semisolid connecting material includes the following steps: adding alloy elements capable of forming intermetallic compound with aluminium in aluminium-base alloy, making electric-arc smelting in low vacuum or under the condition of argon protection, removing crust and cold-rolling into sheet-like material so as to obtain the semisolid connecting material of aluminium-base alloy aluminium-added intermetallic compound. Its connecting method includes the steps: inserting said sheet-like semisolid connecting material between connected materials, pressing in vacuum furnace and heating, heat-insulating and cooling to room temp. to form the joint. Said connecting material is low in cost, easy to implement preparation and connection, and extensive in application range.