Semiconductor and method for producing same


Application Number: 00109222
Application Date: 2000.06.15
Publication Number: 1289146
Publication Date: 2001.03.28
Priority Information: 1999/9/20 JP 265632/99
International: H01L21/56;H01L21/60;H01L23/31;H01L23/48
Applicant(s) Name: NEC Corp.
Address:
Inventor(s) Name: Ikegami Goro
Patent Agency Code: 11021
Patent Agent: zhu haibei
Abstract In a semiconductor device, a semiconductor pellet having bump electrodes and a interconnection board having pad electrodes are brought into mutual opposition with a resin containing a filler therebetween, so that the bump electrode and the pad electrodes are superposed. With the filler remaining at the superposed parts between the electrodes, the electrode superposed parts are hot-pressed, and the semiconductor pellet and interconnection board are adhered by the resin.