Semiconductor device and producing method thereof


Application Number: 00104927
Application Date: 2000.04.04
Publication Number: 1269607
Publication Date: 2000.10.11
Priority Information: 1999/4/5 US 09/285,666
International: H01L23/522;H01L21/768;H01L21/28
Applicant(s) Name: Motorola Co.
Address:
Inventor(s) Name: Alxanda L. Bar;Sulersh Vancartsan;David B. Clerge
Patent Agency Code: 11038
Patent Agent: wang yonggang
Abstract An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier layer (82). In an alternate embodiment a passivation layer (22) overlies the interconnect, the passivation layer (22) has an opening (24) that exposes the interconnect and a conductive barrier layer (32) overlies the interconnect within the opening (24).