Shielding thin film, its mfg. method, and method for mfg. circuit substrate using such shielding film


Application Number: 00108926
Application Date: 2000.05.17
Publication Number: 1274257
Publication Date: 2000.11.22
Priority Information: 1999/5/18 JP 136721/99
International: H05K3/42;H05K3/46
Applicant(s) Name: Matsushita Electric Industrial Co.,Ltd.
Address:
Inventor(s) Name: takenaka Toshiaki;Kondo Toshikazu;Kishimoto Kunio
Patent Agency Code: 11105
Patent Agent: yang wu
Abstract A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.