Soldering flux jetting device and soldering method therewith


Application Number: 00108996
Application Date: 2000.05.26
Publication Number: 1277899
Publication Date: 2000.12.27
Priority Information: 2000/4/25 JP 123391/00; 1999/5/27 JP 147388/99
International: B23K3/00;B23K31/02
Applicant(s) Name: Matsushita Electric Industrial Co., Ltd.
Address:
Inventor(s) Name: Koshi Masuo;Sugimoto Tadahiko;Uchiyama Hiroteru
Patent Agency Code: 31100
Patent Agent: wang hongxiang
Abstract A jet solder feeding device allowing the molten solder ejected from ejecting ports to be kept at a desired height in a stable manner. The molten solder is ejected and fed from multiple ejecting ports formed on a corrugated plate, each wall portion surrounding the multiple ejecting ports formed on the corrugated plate is projected upward by coining or extrusion. This configuration allows the molten solder introduced under the corrugated plate to be satisfactorily guided by the conically shaped wall portion which surrounds each ejecting port and projected upward. Thus the molten solder ejected from the ejecting ports can be kept at a desired height, and in addition, its state is satisfactorily maintained in a stable manner.