Solidified glue silk-screen printing screen frame for circuit board and its processing method

Application Number: 00114251
Application Date: 2000.05.01
Publication Number: 1322106
Publication Date: 2001.11.14
Priority Information:
International: H05K3/36;H05K3/38
Applicant(s) Name: Bi Tianqing
Inventor(s) Name: Bi Tianqing
Patent Agency Code: 44217
Patent Agent: gao tieyuan
Abstract The present invention discloses a screen frame for solidification glue screen printing circuit board, including metal plate, the proper position of back surface of said metal plate is equipped with several projections, and the centre of the projection is equipped with a through-hole communicated with front surface and back surface of the metal plate. Said invention also discloses the method for processing said screen frame, including the following steps: using a metal plate with proper thickness and size; applying anticorrosive protection layer on the printing glued position and making electrocorrion on the back surface of the metal plate to form anti-welling vacancy and projection; and processing through-hole on the centre of projection. Said invention screen frame can be used in mounting process of hybrid packaged circuit board, and can be used for implementing glued one-time screen printing on the surface of projection.