Special forming process of IC package and Sb-Bi refrigerating base board


Application Number: 00107701
Application Date: 2000.05.22
Publication Number: 1324718
Publication Date: 2001.12.05
Priority Information:
International: B29C43/00;B29D7/00;C04B35/622;H01L21/48
Applicant(s) Name: Chen Congzhi
Address:
Inventor(s) Name: Chen Congzhi
Patent Agency Code: 11021
Patent Agent: tang baobeng
Abstract The forming production method of special IC packaging and antimony-bismuth refrigerating base plate includes the following steps: stirring mixed material, extruding and coiling to make coiled material with a certain width; according to width requirements cutting to obtain single unfinished plate; overlapping unifinished plates, applying a certain pressure and heating, after heating exceeds the softening deformatino point of said material, contrinusouly pressurizing and heating to eliminate internal stress, at the same time continuously pressurizing and heating to dry and sinter unfinsished plates, cooling and removing air-pressure source to obtain the invented smooth base plate whose internal stress is fully removed.