Substrate structure for preventing crack generation on weld shielding layer at device position


Application Number  00128491 Application Date  2000.11.24
Publication Number  1355563 Publication Date  2002.06.26
Priority Information    
International
Classification
 H01L23/12;H01L21/50  
Applicant(s) Name  Xipin Fine Industry Co Ltd  
Address    
Inventor(s) Name  Huang Jianping;Chen Jiayin;He Zongda  
Patent Agency Code  11105 Patent Agent  he xiumeng
AbstractA baseplate structure able to prevent cracking of soldering cover layer at device position has top and bottom surfaces and is divided into peripheral regino and device position region. The soldering cover layer is formed on both surfaces but has the exposed part of both surfaces to isolate the said peripheral region from device position region.