Surface installation structure and electronic elements included inside


Application Number: 00104946
Application Date: 2000.03.29
Publication Number: 1270495
Publication Date: 2000.10.18
Priority Information: 1999/3/30 JP 090160/99
International: H01L41/00;H03H9/00
Applicant(s) Name: Murata Manufacturing Co., Ltd.
Address:
Inventor(s) Name: Kichita Ryukei;Amano Tsuneo
Patent Agency Code: 31100
Patent Agent: shen zhaokun
Abstract The present invention discloses a surface mounting structure which is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating substrate, and a piezo-resonator mounted on a mounting surface of the insulating substrate. The piezoelectric component element is mounted on a printed circuit board, with the mounting surface being arranged to face a surface of the printed circuit board. A recess is formed in the printed circuit board and a portion of the piezoelectric component element is accommodated in the recess. A conductive adhesive is located on external connection electrodes provided on the mounting surface and is firmly attached to circuit patterns on the printed circuit board so that the piezoelectric component element is fixed to the printed circuit board. Further, the external connection electrodes are electrically connected to the circuit patterns.