Tag Archives: chip

Epitaxial growth chip used for infrared emitting diode and infrared emitting diode

Application Number: 00118294Application Date: 2000.04.27Publication Number: 1273438Publication Date: 2000.11.15Priority Information: 1999/4/27 JP 119689/1999; 1999/9/21 JP 266483/1999International: H01L33/00Applicant(s) Name: Showa Denko K. K.Address: Inventor(s) Name: Yoshinage Atsushi;Yamamoto JunichiPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention provides an epitaxial wafer comprising, on a p-type GaAs single-crystal substrate, a first p-type layer; a p-type cladding layer;… Read More »

Method for fixing semiconductor chip, and device therefor

Application Number: 00126458Application Date: 2000.09.01Publication Number: 1288259Publication Date: 2001.03.21Priority Information: 1999/9/10 CH 19991695/99International: H01L21/58;B23K3/06Applicant(s) Name: ESEC Trade Corp.Address: Inventor(s) Name: Christoph Luqing;Marks LimachPatent Agency Code: 11038Patent Agent: wang yonggangAbstract With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is… Read More »

Probe card for testing semiconductor chip with many semiconductor device and method thereof

Application Number: 00120070Application Date: 2000.07.05Publication Number: 1285615Publication Date: 2001.02.28Priority Information: 1999/8/19 JP 233109/1999International: G01R1/067;G01R31/26;H01L21/66Applicant(s) Name: Fujitsu Ltd.Address: Inventor(s) Name: Maruyama Shigeyuki;Watanaba NaoyukiPatent Agency Code: 11038Patent Agent: du rixinAbstract A probe card for testing a wafer including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located… Read More »

Gene chip carrier for multiple person diagnosis

Application Number: 00114996Application Date: 2000.03.20Publication Number: 1314493Publication Date: 2001.09.26Priority Information: International: C12Q1/68Applicant(s) Name: Bodao Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Xiao ZiliPatent Agency Code: 00000Patent Agent: Abstract The gene chip carrier for disease diagnosis features its several 1-3 mm long, 1-3 mm wide and 1-3 mm deep sample applying ponds distributed homogeneously… Read More »

Automatized system and semi-conductor chip transfering method for use in semiconductor factory

Application Number: 00122667Application Date: 2000.05.20Publication Number: 1278620Publication Date: 2001.01.03Priority Information: 1999/5/20 KR 18270/99; 1999/6/22 KR 23547/99; 1999/6/22 KR 23548/99; 1999/6/30 KR 25868/99; 1999/6/30 KR 25981/99International: G06F9/00;H01L21/00;B65G49/07Applicant(s) Name: Hyundai Electronic Industries Co., Ltd.Address: Inventor(s) Name: Lee Dai-Ho;Chae Jong-Wun;Lee U-kyuPatent Agency Code: 11105Patent Agent: tao fengbeiAbstract A method for transporting semiconductor wafers in semiconductor factory automation system,… Read More »

Method for preventing rewriting to programmable chip software

Application Number: 00118317Application Date: 2000.06.12Publication Number: 1328294Publication Date: 2001.12.26Priority Information: International: G06F12/14;G06F12/16Applicant(s) Name: Huashuo Computer Co LtdAddress: Inventor(s) Name: Chen YuguangPatent Agency Code: 11105Patent Agent: ma yingAbstract A method for preventing the rewriting to programmable chip software (temporary memory) is disclosed. After a programmable temporary memory chip in computer has heen set up, its is… Read More »

Chip heating device and method for using heated chip

Application Number: 00120146Application Date: 2000.07.18Publication Number: 1282003Publication Date: 2001.01.31Priority Information: 1999/7/26 KR 30350/99International: G03F7/00;H01L21/027;H01L21/30;F28D15/02Applicant(s) Name: Samsung Electronics Co., Ltd.Address: Inventor(s) Name: Park Chan-HeunPatent Agency Code: 11105Patent Agent: li xiaoshuAbstract Provided is a method and apparatus for heating a wafer, adopting one liquid heat transfer medium. The quantity of heat is generated by a heater supply.… Read More »

Washing method for fluorescent label of gene chip and its special elution liquid

Application Number: 00114997Application Date: 2000.03.20Publication Number: 1314494Publication Date: 2001.09.26Priority Information: International: C12Q1/68Applicant(s) Name: Bode Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Li YaoPatent Agency Code: 00000Patent Agent: Abstract The proper Cy3 eluting liquid is solvent Tween 20, which has the molecular weight about equal to that of Cy3 and can dissolve Cy3. Cy3… Read More »

Technology for making unwound chip inductor

Application Number: 00123426Application Date: 2000.08.15Publication Number: 1338762Publication Date: 2002.03.06Priority Information: International: H01F41/00;H01F17/00Applicant(s) Name: Jiaye Science and Technology Co LtdAddress: Inventor(s) Name: Wang Hongguang;Wang LeiyaPatent Agency Code: 11021Patent Agent: tang baobengAbstract A technology for manufacturing unwound chip inductor includes such steps as preparing a square or cylindrical main body, coating an electrically conducting metal film, laser… Read More »

Chip type electronic elements

Application Number: 00118320Application Date: 2000.06.09Publication Number: 1277441Publication Date: 2000.12.20Priority Information: 1999/6/10 JP 164051/99International: H01C7/00;H01C7/04Applicant(s) Name: Murata Manufacturing Co., Ltd.Address: Inventor(s) Name: Ueda Arioriko;Kawase MasahikoPatent Agency Code: 31100Patent Agent: sun jingguoAbstract The invention discloses a chip-type electronic device has a sintered ceramic body formed by integrally sintering a plurality of ceramic layers, inner electrodes including first… Read More »

Technology for making capacitor buried chip in channel dynamic RAM

Application Number: 00120189Application Date: 2000.07.20Publication Number: 1285616Publication Date: 2001.02.28Priority Information: 1999/7/29 US 09/354,743International: H01L21/70;H01L21/82;H01L21/8242Applicant(s) Name: IBM Corp.Address: Inventor(s) Name: Wolaike Geluening;Karl J. Radens;Dark TebenPatent Agency Code: 11038Patent Agent: wang yonggangAbstract A process for manufacturing a deep trench capacitor in a trench. The capacitor comprises a collar in an upper region of the trench and a… Read More »

Method for labelling gene chip inverse transcription probe

Application Number: 00115000Application Date: 2000.03.20Publication Number: 1314594Publication Date: 2001.09.26Priority Information: International: C12Q1/68;G01N33/533;G01N33/543;G01N33/68Applicant(s) Name: Bodao Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Li YaoPatent Agency Code: 00000Patent Agent: Abstract The method includes providing the optimal consumption range of inverse transcriptase, base random primer, Oligo dT mixture, neucleotide without fluorescent label, neucleotide with fluorescent label… Read More »

Technology for making chip inductor

Application Number: 00123427Application Date: 2000.08.15Publication Number: 1338763Publication Date: 2002.03.06Priority Information: International: H01F17/00;H01F41/00Applicant(s) Name: Jiaye Science and Technology Co LtdAddress: Inventor(s) Name: Wang Hongguang;Wang LeiyaPatent Agency Code: 11021Patent Agent: tang baobengAbstract A technology for manufacturing chip inductor includes such steps as planning multiple chips on a substrate, perforating on the end face of each chip, filling… Read More »

Epitaxial chip used for infrared light-emitting component, and light-emitting component using said chip

Application Number: 00118399Application Date: 2000.06.16Publication Number: 1278111Publication Date: 2000.12.27Priority Information: 1999/6/18 JP 172482/1999; 1999/9/21 JP 266483/1999International: H01L33/00;H01S5/30Applicant(s) Name: Showa Denko K. K.Address: Inventor(s) Name: Yoshinaga Atsushi;Yamamoto Junichi;Yamazaki AkihiroPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention provides an epitaxial wafer which is obtained by sequentially forming, on an n-type GaAs substrate, a first n-type… Read More »

Production method of high-brightness LED chip using zinc oxide as its window layer

Application Number: 00111112Application Date: 2000.05.19Publication Number: 1271966Publication Date: 2000.11.01Priority Information: International: H01L33/00;H01S5/32Applicant(s) Name: Shandong Univ.Address: Inventor(s) Name: Huang Baibiao;Zhang Zhaochun;Yu YongqinPatent Agency Code: 37200Patent Agent: liu xudongAbstract When a metallic organic compound vapour phase deposition (MOCVD) method is used for epitaxial growth of diode material, the MOCVD epitaxy growth technology in continuously used after the… Read More »

Chip corresponding method for chip loading equipment

Application Number: 00121330Application Date: 2000.07.20Publication Number: 1335580Publication Date: 2002.02.13Priority Information: International: H01L21/00Applicant(s) Name: Inst. of Industrial TechnologyAddress: Inventor(s) Name: Wang Yusheng;Huang Jianrong;Chen GuanzhouPatent Agency Code: 11127Patent Agent: li qiangAbstract The chip corresponding method adopts type signal to speed the judgment. The present invention uses the position type signal produced from the absolute position and the… Read More »

IC card chip using 8-bit data transmittion and its verification method

Application Number: 00115338Application Date: 2000.04.03Publication Number: 1316721Publication Date: 2001.10.10Priority Information: International: G06K19/073Applicant(s) Name: Beiling Co Ltd, ShanghaiAddress: Inventor(s) Name: Ma LiPatent Agency Code: 31100Patent Agent: hong lingAbstract An IC card chip using 8-bit data transmission is disclosed. Its verifying method features that 64 bit data is transmitted between said IC card chip and R/W device… Read More »

Method for packing miniature semiconductor chip

Application Number: 00123569Application Date: 2000.08.22Publication Number: 1338773Publication Date: 2002.03.06Priority Information: International: H01L21/50Applicant(s) Name: Huatai Electronic Co LtdAddress: Inventor(s) Name: Xie WenlePatent Agency Code: 11127Patent Agent: chen yuxuanAbstract A method for packaging thin semiconductor chip includes such steps as loading a chip on substrate, welding a metal wire to aluminium pad on the substrate for connecting… Read More »

Equipment for processing chip

Application Number: 00118709Application Date: 2000.05.19Publication Number: 1275795Publication Date: 2000.12.06Priority Information: 1999/5/19 DE 19922919.8International: H01L21/00;H01L21/66;G06F17/00Applicant(s) Name: Siemens AGAddress: Inventor(s) Name: R. HuberPatent Agency Code: 72001Patent Agent: zhang zhichengAbstract A wafer processing system is described located in at least one clean room and having an arrangement of manufacturing units for performing individual manufacturing operations. In a manufacturing… Read More »

Method for decreasing thickness of window layer of high-brightness LED chip by doping technology

Application Number: 00111113Application Date: 2000.05.19Publication Number: 1271967Publication Date: 2000.11.01Priority Information: International: H01L33/00;H01S5/32Applicant(s) Name: Shandong Univ.Address: Inventor(s) Name: Huang Baibiao;Zhang Zhaochun;Yu YongqinPatent Agency Code: 37200Patent Agent: liu xudongAbstract A metallic organic compound vapour phase deposition (MOCVD) is used to grow heterojunction chip structure of high-brightness LED and GaAs substrate. When the growth of upper limitation layer… Read More »

Chip connecting method for chip assembly

Application Number: 00121465Application Date: 2000.07.24Publication Number: 1335642Publication Date: 2002.02.13Priority Information: International: H01L21/50Applicant(s) Name: Huatai Electronics Co., Ltd.Address: Inventor(s) Name: Xie Wenle;Zhuang Yongcheng;Huang NingPatent Agency Code: 11127Patent Agent: chen yuxuanAbstract The chip connecting method for stacking two chips with the same size onto one identical substrate includes hot pressing of the lugs in the mother bearing… Read More »

Process for preparing polymorphic test chip for hepatitis B virus and its application

Application Number: 00116875Application Date: 2000.06.30Publication Number: 1331346Publication Date: 2002.01.16Priority Information: International: C12Q1/68Applicant(s) Name: Shanghai Inst of Metallurgy, Chinese Academy of SciencesAddress: Inventor(s) Name: Zhao Jianlong;Yuan Zhenghong;Zhu BinPatent Agency Code: 31002Patent Agent: fei kaikuiAbstract A process for preparing the polymorphic test chip of hepatitis B virus includes designing oligonucleotide probe according to the information about the… Read More »

Sealing structure for flip chip on carrier

Application Number: 00123593Application Date: 2000.08.24Publication Number: 1339821Publication Date: 2002.03.13Priority Information: International: H01L23/12;H01L23/495Applicant(s) Name: Huatai Electronics Co., Ltd.Address: Inventor(s) Name: Xie Wenle;Zhuang Yongcheng;Huang NingPatent Agency Code: 11127Patent Agent: li qiangAbstract The flip chip structure is formed through adhering flip chip on carrier, composing the other chip and sealing and includes carrier as chip support, mother chip… Read More »

Compound micro path array chip and its preparing method

Application Number: 00119003Application Date: 2000.10.10Publication Number: 1290752Publication Date: 2001.04.11Priority Information: International: C12Q1/00;G01N33/00Applicant(s) Name: Lu ZuhongAddress: Inventor(s) Name: Lu Zuhong;He Nongyue;Zhu JijunPatent Agency Code: 32102Patent Agent: xi shengyuanAbstract The present invention features that after miniature via holes are machined in a solid base plate in certain thickness, or an adhered capillary bundle is formed and specific… Read More »

Gene chip for the diagnosis of infectious disease hepatitis B virus, syphilis spirochete, AIDS virus and hepatitis C virus

Application Number: 00111705Application Date: 2000.02.21Publication Number: 1310236Publication Date: 2001.08.29Priority Information: International: C12Q1/04;C12Q1/68Applicant(s) Name: Shanghai Bodao Gene Techn Co., Ltd.Address: Inventor(s) Name: Mao Yumin;Xie Yi;Li YaoPatent Agency Code: 72003Patent Agent: lou xianyangAbstract The present invention discloses one gene chip for the diagnosis of infectious disease HBV, TP, HIV and HCV, and provides high recognition rate primer… Read More »

Far-end acess and reproducing chip and device of degital contents and its charge method

Application Number: 00121692Application Date: 2000.07.21Publication Number: 1334514Publication Date: 2002.02.06Priority Information: International: G06F12/00;G06F13/14Applicant(s) Name: Hengsheng Electronic Co., LtdAddress: Inventor(s) Name: Luo Ruixiang;Ke JieyuanPatent Agency Code: 11105Patent Agent: ma yingAbstract A far-end access and reproducing chip of digital contents for downloading the digital contents from external system is composed of DSP and microprocessor. When said DSP is… Read More »

Platable end paste for chip inductor

Application Number: 00117535Application Date: 2000.10.30Publication Number: 1289129Publication Date: 2001.03.28Priority Information: International: C09D5/24;H01B1/00;H01B1/22;H01F27/28Applicant(s) Name: Zhaoqing Fenghua Electronic Engineering Development Co., Ltd., Guangdong Prov.Address: Inventor(s) Name: Yao Qingmin;Chen Jinqing;Liu HuichongPatent Agency Code: 44104Patent Agent: Abstract The present invention relates to a platable end sluury for sheet inducer, and is characterized by that it is formed from organic… Read More »

DIMM chip group control circuit

Application Number: 00123784Application Date: 2000.09.06Publication Number: 1341910Publication Date: 2002.03.27Priority Information: International: G06F13/00Applicant(s) Name: Huashuo Computer Co. Ltd.Address: Inventor(s) Name: Zeng RenmingPatent Agency Code: 72003Patent Agent: pan peikunAbstract The invention discloses a control circuit allowed using DIMM without buffer in a system having chips that only support to user registering Dual In-Line Memory Module. The control… Read More »

Optical disk chip

Application Number: 00119231Application Date: 2000.03.25Publication Number: 1273416Publication Date: 2000.11.15Priority Information: 1999/3/25 KR 10272/99International: G11B7/007;G11B7/24Applicant(s) Name: Samsung Electroics Co., Ltd.Address: Inventor(s) Name: Yun Doo-Sop;Park Chang-MinPatent Agency Code: 11105Patent Agent: ma yingAbstract An optical disc substrate with deep grooves having a depth of lambda /4n to lambda /2n, where lambda is the wavelength of a laser beam… Read More »

Nucteic acid amplification gene chip hybridization detecting instrument

Application Number: 00112248Application Date: 2000.04.30Publication Number: 1321890Publication Date: 2001.11.14Priority Information: International: C12Q1/68;G01N33/50Applicant(s) Name: Yilai Gene Medical Co. Ltd., NanjingAddress: Inventor(s) Name: Zhao Yujie;Zhu Jijun;Liu QuanjunPatent Agency Code: 32207Patent Agent: lu qunAbstract The nucleic acid amplification gene chip hydridization detection apparatus is formed from machine shell, machine frame, detection device, conveying device, temp. control device, cleaning… Read More »