Tag Archives: chip

Method for making nucleic acid molecular hybridization by using gene chip

Application Number  00129343 Application Date  2000.11.22 Publication Number  1354260 Publication Date  2002.06.19 Priority Information     International Classification  C12Q1/68   Applicant(s) Name  Wu Chang   Address     Inventor(s) Name  Wu Chang;Wu Ming   Patent Agency Code  00000 Patent Agent   AbstractThe method for making nucleic acid molecular hybridization by using gene chip is characterized… Read More »

Oxide magnetic material and chip

Application Number  00128867 Application Date  2000.08.18 Publication Number  1291777 Publication Date  2001.04.18 Priority Information   1999/8/19 JP 232412/99; 1999/9/17 JP 262934/99; 1999/9/17 JP 262935/99   International Classification  H01F1/10;H01F1/34;H01F5/00;H01F17/00;C01G49/00   Applicant(s) Name  TDK Corp.   Address     Inventor(s) Name  Ito Kei;Takahashi Sachio;Onu Takuya   Patent Agency Code  72001 Patent Agent  lu xinhua AbstractAn oxide magnetic… Read More »

Electronic line chip

Application Number  00128792 Application Date  1995.04.11 Publication Number  1332265 Publication Date  2002.01.23 Priority Information   1994/4/11 JP 96941/1994   International Classification  H01L23/373;C23C2/00;H05K3/02;C04B41/88   Applicant(s) Name  Dowa Mining Co., Ltd.   Address     Inventor(s) Name  Ning xiaoshan;Korida Nagatoshi;Oba Seibi   Patent Agency Code  11038 Patent Agent  long chuangong AbstractCeramic members 2 are fed successively into… Read More »

Chip parts on glass and connecting material used thereof

Application Number  00128581 Application Date  2000.09.14 Publication Number  1293467 Publication Date  2001.05.02 Priority Information   1999/9/14 JP 261096/99   International Classification  H01L21/52;H01L21/58;H01R11/01   Applicant(s) Name  Sony Chemical Co., Ltd.   Address     Inventor(s) Name  Takeichi Genshu;Tohei Hiroyuki   Patent Agency Code  72001 Patent Agent  zhang zhicheng AbstractA chip-on-glass (COG) assembly, in which the electrodes… Read More »

Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly

Application Number  00128333 Application Date  2000.11.24 Publication Number  1300180 Publication Date  2001.06.20 Priority Information   1999/11/24 JP 333409/1999   International Classification  G06K19/07;H05K3/00;H05K3/30   Applicant(s) Name  Omron Corp.   Address     Inventor(s) Name  Kawai Wakato   Patent Agency Code  11038 Patent Agent  wang yonggang AbstractThe present invention is to quickly and electrically and mechanically reliably… Read More »

Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly

Application Number  00128333 Application Date  2000.11.24 Publication Number  1300180 Publication Date  2001.06.20 Priority Information   1999/11/24 JP 333409/1999   International Classification  G06K19/07;H05K3/00;H05K3/30   Applicant(s) Name  Omron Corp.   Address     Inventor(s) Name  Kawai Wakato   Patent Agency Code  11038 Patent Agent  wang yonggang AbstractThe present invention is to quickly and electrically and mechanically reliably… Read More »

Integrated instrument for designing ASIC chip, analoging by combining software with hardware and testing it

Application Number: 00113352Application Date: 2000.04.03Publication Number: 1316694Publication Date: 2001.10.10Priority Information: International: G06F11/00Applicant(s) Name: National Defense Science and Technology Univ, PLAAddress: Inventor(s) Name: Chen Shuming;Lu Guangzhao;Sun YongjiePatent Agency Code: 43008Patent Agent: zhao hongAbstract An integrated instrument for simulating the design of ASIC chip by cooperation of software and hardware and testing the ASIC chip is disclosed,… Read More »

DNA chip for detecting 6-zwischenferment gene mutation

Application Number: 00122161Application Date: 2000.07.23Publication Number: 1335409Publication Date: 2002.02.13Priority Information: International: C12Q1/68Applicant(s) Name: Zhejiang Jiangnan Biological Science &. Technology Co., Ltd.Address: Inventor(s) Name: Ye BangcePatent Agency Code: 33200Patent Agent: zhang fagaoAbstract The present invention discloses one kind of DNA chip for detecting zwischenferment gene mutation. The specific DNA probes for detecting gene mutation related to… Read More »

Probe unit for inspection of base board for assemblying semiconductor chip

Application Number: 00117650Application Date: 2000.05.26Publication Number: 1276530Publication Date: 2000.12.13Priority Information: 1999/5/27 JP 148729/1999International: G01R1/073;H01L21/66Applicant(s) Name: NHK Spring Co., Ltd.Address: Inventor(s) Name: Ishikawa Shigeki;Nanseki KenjiPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention is to prevent a damage to a contact probe unit when applying the unit to a based board carrying semiconductor chips due… Read More »

Electronic device comprising packet of chip plug-in unit

Application Number: 00126041Application Date: 2000.08.25Publication Number: 1286592Publication Date: 2001.03.07Priority Information: 1999/8/25 EP 99810762.7; 1999/9/3 EP 99810796.5International: H01L25/00;H05K5/00;H05K13/00Applicant(s) Name: Smart Data AGAddress: Inventor(s) Name: J.P. ButtetPatent Agency Code: 72001Patent Agent: yang yongAbstract Electronic device including a housing for receiving chipcards having electrical connection elements which are situated on at least one of their lateral faces, said… Read More »

DNA chip for detecting related gene mutation resulted in production of drug resistance of tubercle bacillus

Application Number: 00119877Application Date: 2000.09.05Publication Number: 1341752Publication Date: 2002.03.27Priority Information: International: C12Q1/04;C12Q1/68Applicant(s) Name: Huadong Univ. of Science & EngineeringAddress: Inventor(s) Name: Ye BangcePatent Agency Code: 31203Patent Agent: luo dachenAbstract The present invention discloses a DNA chip for detecting related gene mutation resulted into drug resistance of tubercle bacillus. On the surface of the slide, etc.… Read More »

Integrated method for analoging and testing ASIC chip by combining software with hardware

Application Number: 00113353Application Date: 2000.04.03Publication Number: 1316695Publication Date: 2001.10.10Priority Information: International: G06F11/00Applicant(s) Name: National Defense Science and Technology Univ, PLAAddress: Inventor(s) Name: Chen Shuming;Sun Yongjie;Yu ZaixiangPatent Agency Code: 43008Patent Agent: zhao hongAbstract An integrated method for simulating and testing ASIC design by the cooperation of hardware and software is based on "existing-response" principle, and features… Read More »

Method for installing semiconductor chip

Application Number: 00122531Application Date: 2000.08.04Publication Number: 1320957Publication Date: 2001.11.07Priority Information: 2000/4/25 JP 124878/2000International: G11B5/00;H01L21/58Applicant(s) Name: Fujitsu Ltd.Address: Inventor(s) Name: Umaba Shunji;Yamaue Takatoyo;Uminuma TsuneoPatent Agency Code: 11038Patent Agent: ma gaoAbstract A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive… Read More »

Epitaxial growth chip used for infrared emitting diode and infrared emitting diode

Application Number: 00118294Application Date: 2000.04.27Publication Number: 1273438Publication Date: 2000.11.15Priority Information: 1999/4/27 JP 119689/1999; 1999/9/21 JP 266483/1999International: H01L33/00Applicant(s) Name: Showa Denko K. K.Address: Inventor(s) Name: Yoshinage Atsushi;Yamamoto JunichiPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention provides an epitaxial wafer comprising, on a p-type GaAs single-crystal substrate, a first p-type layer; a p-type cladding layer;… Read More »

Method for fixing semiconductor chip, and device therefor

Application Number: 00126458Application Date: 2000.09.01Publication Number: 1288259Publication Date: 2001.03.21Priority Information: 1999/9/10 CH 19991695/99International: H01L21/58;B23K3/06Applicant(s) Name: ESEC Trade Corp.Address: Inventor(s) Name: Christoph Luqing;Marks LimachPatent Agency Code: 11038Patent Agent: wang yonggangAbstract With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is… Read More »

Probe card for testing semiconductor chip with many semiconductor device and method thereof

Application Number: 00120070Application Date: 2000.07.05Publication Number: 1285615Publication Date: 2001.02.28Priority Information: 1999/8/19 JP 233109/1999International: G01R1/067;G01R31/26;H01L21/66Applicant(s) Name: Fujitsu Ltd.Address: Inventor(s) Name: Maruyama Shigeyuki;Watanaba NaoyukiPatent Agency Code: 11038Patent Agent: du rixinAbstract A probe card for testing a wafer including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located… Read More »

Gene chip carrier for multiple person diagnosis

Application Number: 00114996Application Date: 2000.03.20Publication Number: 1314493Publication Date: 2001.09.26Priority Information: International: C12Q1/68Applicant(s) Name: Bodao Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Xiao ZiliPatent Agency Code: 00000Patent Agent: Abstract The gene chip carrier for disease diagnosis features its several 1-3 mm long, 1-3 mm wide and 1-3 mm deep sample applying ponds distributed homogeneously… Read More »

Automatized system and semi-conductor chip transfering method for use in semiconductor factory

Application Number: 00122667Application Date: 2000.05.20Publication Number: 1278620Publication Date: 2001.01.03Priority Information: 1999/5/20 KR 18270/99; 1999/6/22 KR 23547/99; 1999/6/22 KR 23548/99; 1999/6/30 KR 25868/99; 1999/6/30 KR 25981/99International: G06F9/00;H01L21/00;B65G49/07Applicant(s) Name: Hyundai Electronic Industries Co., Ltd.Address: Inventor(s) Name: Lee Dai-Ho;Chae Jong-Wun;Lee U-kyuPatent Agency Code: 11105Patent Agent: tao fengbeiAbstract A method for transporting semiconductor wafers in semiconductor factory automation system,… Read More »

Method for preventing rewriting to programmable chip software

Application Number: 00118317Application Date: 2000.06.12Publication Number: 1328294Publication Date: 2001.12.26Priority Information: International: G06F12/14;G06F12/16Applicant(s) Name: Huashuo Computer Co LtdAddress: Inventor(s) Name: Chen YuguangPatent Agency Code: 11105Patent Agent: ma yingAbstract A method for preventing the rewriting to programmable chip software (temporary memory) is disclosed. After a programmable temporary memory chip in computer has heen set up, its is… Read More »

Chip heating device and method for using heated chip

Application Number: 00120146Application Date: 2000.07.18Publication Number: 1282003Publication Date: 2001.01.31Priority Information: 1999/7/26 KR 30350/99International: G03F7/00;H01L21/027;H01L21/30;F28D15/02Applicant(s) Name: Samsung Electronics Co., Ltd.Address: Inventor(s) Name: Park Chan-HeunPatent Agency Code: 11105Patent Agent: li xiaoshuAbstract Provided is a method and apparatus for heating a wafer, adopting one liquid heat transfer medium. The quantity of heat is generated by a heater supply.… Read More »

Washing method for fluorescent label of gene chip and its special elution liquid

Application Number: 00114997Application Date: 2000.03.20Publication Number: 1314494Publication Date: 2001.09.26Priority Information: International: C12Q1/68Applicant(s) Name: Bode Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Li YaoPatent Agency Code: 00000Patent Agent: Abstract The proper Cy3 eluting liquid is solvent Tween 20, which has the molecular weight about equal to that of Cy3 and can dissolve Cy3. Cy3… Read More »

Technology for making unwound chip inductor

Application Number: 00123426Application Date: 2000.08.15Publication Number: 1338762Publication Date: 2002.03.06Priority Information: International: H01F41/00;H01F17/00Applicant(s) Name: Jiaye Science and Technology Co LtdAddress: Inventor(s) Name: Wang Hongguang;Wang LeiyaPatent Agency Code: 11021Patent Agent: tang baobengAbstract A technology for manufacturing unwound chip inductor includes such steps as preparing a square or cylindrical main body, coating an electrically conducting metal film, laser… Read More »

Chip type electronic elements

Application Number: 00118320Application Date: 2000.06.09Publication Number: 1277441Publication Date: 2000.12.20Priority Information: 1999/6/10 JP 164051/99International: H01C7/00;H01C7/04Applicant(s) Name: Murata Manufacturing Co., Ltd.Address: Inventor(s) Name: Ueda Arioriko;Kawase MasahikoPatent Agency Code: 31100Patent Agent: sun jingguoAbstract The invention discloses a chip-type electronic device has a sintered ceramic body formed by integrally sintering a plurality of ceramic layers, inner electrodes including first… Read More »

Technology for making capacitor buried chip in channel dynamic RAM

Application Number: 00120189Application Date: 2000.07.20Publication Number: 1285616Publication Date: 2001.02.28Priority Information: 1999/7/29 US 09/354,743International: H01L21/70;H01L21/82;H01L21/8242Applicant(s) Name: IBM Corp.Address: Inventor(s) Name: Wolaike Geluening;Karl J. Radens;Dark TebenPatent Agency Code: 11038Patent Agent: wang yonggangAbstract A process for manufacturing a deep trench capacitor in a trench. The capacitor comprises a collar in an upper region of the trench and a… Read More »

Method for labelling gene chip inverse transcription probe

Application Number: 00115000Application Date: 2000.03.20Publication Number: 1314594Publication Date: 2001.09.26Priority Information: International: C12Q1/68;G01N33/533;G01N33/543;G01N33/68Applicant(s) Name: Bodao Gene Development Co., Ltd., ShanghaiAddress: Inventor(s) Name: Mao Yumin;Xie Yi;Li YaoPatent Agency Code: 00000Patent Agent: Abstract The method includes providing the optimal consumption range of inverse transcriptase, base random primer, Oligo dT mixture, neucleotide without fluorescent label, neucleotide with fluorescent label… Read More »

Technology for making chip inductor

Application Number: 00123427Application Date: 2000.08.15Publication Number: 1338763Publication Date: 2002.03.06Priority Information: International: H01F17/00;H01F41/00Applicant(s) Name: Jiaye Science and Technology Co LtdAddress: Inventor(s) Name: Wang Hongguang;Wang LeiyaPatent Agency Code: 11021Patent Agent: tang baobengAbstract A technology for manufacturing chip inductor includes such steps as planning multiple chips on a substrate, perforating on the end face of each chip, filling… Read More »

Epitaxial chip used for infrared light-emitting component, and light-emitting component using said chip

Application Number: 00118399Application Date: 2000.06.16Publication Number: 1278111Publication Date: 2000.12.27Priority Information: 1999/6/18 JP 172482/1999; 1999/9/21 JP 266483/1999International: H01L33/00;H01S5/30Applicant(s) Name: Showa Denko K. K.Address: Inventor(s) Name: Yoshinaga Atsushi;Yamamoto Junichi;Yamazaki AkihiroPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention provides an epitaxial wafer which is obtained by sequentially forming, on an n-type GaAs substrate, a first n-type… Read More »

Production method of high-brightness LED chip using zinc oxide as its window layer

Application Number: 00111112Application Date: 2000.05.19Publication Number: 1271966Publication Date: 2000.11.01Priority Information: International: H01L33/00;H01S5/32Applicant(s) Name: Shandong Univ.Address: Inventor(s) Name: Huang Baibiao;Zhang Zhaochun;Yu YongqinPatent Agency Code: 37200Patent Agent: liu xudongAbstract When a metallic organic compound vapour phase deposition (MOCVD) method is used for epitaxial growth of diode material, the MOCVD epitaxy growth technology in continuously used after the… Read More »

Chip corresponding method for chip loading equipment

Application Number: 00121330Application Date: 2000.07.20Publication Number: 1335580Publication Date: 2002.02.13Priority Information: International: H01L21/00Applicant(s) Name: Inst. of Industrial TechnologyAddress: Inventor(s) Name: Wang Yusheng;Huang Jianrong;Chen GuanzhouPatent Agency Code: 11127Patent Agent: li qiangAbstract The chip corresponding method adopts type signal to speed the judgment. The present invention uses the position type signal produced from the absolute position and the… Read More »

IC card chip using 8-bit data transmittion and its verification method

Application Number: 00115338Application Date: 2000.04.03Publication Number: 1316721Publication Date: 2001.10.10Priority Information: International: G06K19/073Applicant(s) Name: Beiling Co Ltd, ShanghaiAddress: Inventor(s) Name: Ma LiPatent Agency Code: 31100Patent Agent: hong lingAbstract An IC card chip using 8-bit data transmission is disclosed. Its verifying method features that 64 bit data is transmitted between said IC card chip and R/W device… Read More »