Tag Archives: COPPER

Copper aluminium-cerium aluminium compound oxide combustion catalyst, its preparation and use

Application Number  00129260 Application Date  2000.09.29 Publication Number  1345629 Publication Date  2002.04.24 Priority Information     International Classification  B01J23/835;C10G11/18;C10K3/00   Applicant(s) Name  Beijing Univ.   Address     Inventor(s) Name  Lin Bingxiong;Zhang Wenjing;Liu Yingjun   Patent Agency Code  11038 Patent Agent  ren zonghua AbstractThe present invention relates to a non-nobile metal carbon monoxide combustion catalyst… Read More »

Copper foil for printed circuit and its manufacture

Application Number  00128973 Application Date  1994.03.29 Publication Number  1295426 Publication Date  2001.05.16 Priority Information   1993/8/31 JP 237181/93; 1993/3/29 JP 91842/93   International Classification  C25D5/00;C25D11/38;H05K1/09;H05K3/00   Applicant(s) Name  Japan Energy Corp.   Address     Inventor(s) Name  Kawasumi Yoshio   Patent Agency Code  31100 Patent Agent  zhang mingyu AbstractA copper foil for printed circuits including… Read More »

Binding treatment of copper sheet with improved binding strength and bottom cutting resistant

Application Number  00128414 Application Date  2000.09.29 Publication Number  1301130 Publication Date  2001.06.27 Priority Information   1999/9/29 US 09/408,170   International Classification  H05K3/38   Applicant(s) Name  American Yeats Sheets Corp.   Address     Inventor(s) Name  C.B. Yeats;G. Gaskyll;C.T. Cheng   Patent Agency Code  31100 Patent Agent  zhu limeng AbstractThe present invention provides a treated electrodeposited… Read More »

Internal screw copper pipe machining process and its special apparatus

Application Number: 00119013Application Date: 2000.10.10Publication Number: 1347775Publication Date: 2002.05.08Priority Information: International: B21D35/00;B21H3/08Applicant(s) Name: Suzhou Canghuan Electromechanical Industry Co., Ltd.Address: Inventor(s) Name: Zhou Zhihong;Yan RuiPatent Agency Code: 32103Patent Agent: sun fangweiAbstract The present invention features that the copper pipe after being annealed in an in-situ annealing apparatus is fed to an inner screw forming machine directly… Read More »

Conductive copper wire with redundant liner

Application Number: 00126420Application Date: 2000.08.31Publication Number: 1286497Publication Date: 2001.03.07Priority Information: 1999/9/1 US 09/388132International: H01L23/52;H01L23/48;H01L21/768;H01L21/283;H01G4/005;H01G4/228;H05K1/00Applicant(s) Name: IBM Corp.Address: Inventor(s) Name: A.K. StapperPatent Agency Code: 72001Patent Agent: yang kaiAbstract Interconnections including copper conductor lines, vias and Damascene lines comprise an insulator or dielectric having openings therein, a first adhesion promoting conductive barrier liner material on the walls… Read More »

Process for comprehensively recovering very-low-grade copper from iron ore

Application Number: 00116049Application Date: 2000.09.27Publication Number: 1317371Publication Date: 2001.10.17Priority Information: International: B03D1/004Applicant(s) Name: Wuhan Iron and Steel (Group) CoAddress: Inventor(s) Name: Yu Kuixiang;Xiao Gan;Tang Xin'anPatent Agency Code: 42102Patent Agent: cheng yuhanAbstract A process for recovering very-low-grade copper from iron ore includes grinding, sieving while magnetic separation to separate out iron ore concentrate, mixed floatation, adding… Read More »

Making process of silver-containing copper material in special shape

Application Number: 00119057Application Date: 2000.10.24Publication Number: 1350066Publication Date: 2002.05.22Priority Information: International: C22C9/00;C22F1/08Applicant(s) Name: Taixing City Oxygen-free Copper Material WorksAddress: Inventor(s) Name: Fu RongbinPatent Agency Code: 00000Patent Agent: Abstract The production method of shaped copper material nicludes the following steps: silver-doping in copper material, extruding, designing and preparing mould, first-pass special deformation, second-pass special deformation, stripping… Read More »

Electro-deposition copper foil through surface-processing, its mfg. method and use thereof

Application Number: 00126496Application Date: 2000.08.31Publication Number: 1289225Publication Date: 2001.03.28Priority Information: 1999/8/31 JP 244882/99International: H05K3/38Applicant(s) Name: Mitsui Mining & Smelting Co., Ltd.Address: Inventor(s) Name: Kurabe Shinobu;Shibata Mitsuto;Mitsuhashi MasakazuPatent Agency Code: 31100Patent Agent: bai yihuaAbstract A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having… Read More »

Positive-pressure sealer of red copper crystallizing mould and positive-pressure casting technology for red copper

Application Number: 00116394Application Date: 2000.06.08Publication Number: 1327893Publication Date: 2001.12.26Priority Information: International: B22D21/00;B22D21/02Applicant(s) Name: Wang XiaobangAddress: Inventor(s) Name: Wang XiaobangPatent Agency Code: 31100Patent Agent: du lulingAbstract A positive-pressure sealer for red copper crystallizing mould is composed of crystallizing mould and its seat, water spraying ring at bottom of said seat, sealing assembly and lift unit. Said… Read More »

Electro-deposition copper foil and its manufacturing method

Application Number: 00119975Application Date: 2000.06.30Publication Number: 1292432Publication Date: 2001.04.25Priority Information: 1999/6/30 JP 185444/99International: C25D1/04Applicant(s) Name: Mitsui Mining & Smelting Co., Ltd.Address: Inventor(s) Name: Takahashi Naoomi;Hirasawa HiroshiPatent Agency Code: 31100Patent Agent: zhou chengzeAbstract The present invention relates to a method for manufacturing electrolytic copper foil by using an electrolytic solution in which copper concentration is within… Read More »

Preparation method of rare-earth copper oxide ceramic powder body

Application Number: 00110556Application Date: 2000.06.21Publication Number: 1328980Publication Date: 2002.01.02Priority Information: International: C04B35/45;C04B35/622Applicant(s) Name: Inst. of Metals, Chinese Academy of SciencesAddress: Inventor(s) Name: Zhou Yanchun;Wang XiaohuiPatent Agency Code: 21002Patent Agent: zhang chenAbstract The preparation method of rare earth copper oxide ceramic powder uses the nitrate of correspondent metal as oxidant, uses urea as burning agent and… Read More »

A novel polypeptide-human copper transport protein 11.77 and polynucleotide for coding this polypeptide

Application Number: 00116604Application Date: 2000.06.19Publication Number: 1329062Publication Date: 2002.01.02Priority Information: International: A61K31/7088;A61K38/16;A61K38/17;A61K39/395;A61P7/00;A61P31/00;A61P31/18;A61P35/00;A61P37/00;C07H21/00;C07K14/00;C07K14/435;C07K16/00;C07K16/18;C12N15/10;C12N15/11;C12N15/12;C12N15/63;C12N15/64;C12P21/00;C12Q1/68;G01N33/68Applicant(s) Name: Shanghai Bode Gene Development Co. Ltd.Address: Inventor(s) Name: Mao Yumin;Xie YiPatent Agency Code: 00000Patent Agent: Abstract The present invention discloses a novel polypeptide-human copper transport protein 11.77, polynucleotide for coding this polypeptide and a method for producing this polypeptide by using DNA… Read More »

Dielectric material having intrinsic copper ion migration barrier low dielectric constant

Application Number: 00122701Application Date: 2000.08.08Publication Number: 1295339Publication Date: 2001.05.16Priority Information: 1999/8/10 US 09/371,340International: H01L21/283;H01L21/312;H01L21/3205;H01L21/768Applicant(s) Name: International Business Machine Corp.Address: Inventor(s) Name: Stephan Alain Cohan;Claudels Ferger;Jaffrey Kertis HetzkerPatent Agency Code: 11038Patent Agent: wang yonggangAbstract An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the… Read More »

Copper smelting technology and air-tight smelting furnace

Application Number: 00111412Application Date: 2000.01.03Publication Number: 1302996Publication Date: 2001.07.11Priority Information: International: F27B5/05Applicant(s) Name: Wang XiaobangAddress: Inventor(s) Name: Wang XiaobangPatent Agency Code: 31128Patent Agent: li gaodongAbstract A technique for smelting copper features that after the copper is fully molten, a low-pressure refining in an air-tight furnace is performed to obtain high-density copper billet with low air… Read More »

A novel polypeptide-human copper transport protein 9.9 and polynucleotide for coding this polypeptide

Application Number: 00116659Application Date: 2000.06.21Publication Number: 1329081Publication Date: 2002.01.02Priority Information: International: A61K31/7088;A61K38/16;A61K38/17;A61K39/395;A61P7/00;A61P31/00;A61P31/18;A61P35/00;A61P37/00;C07H21/00;C07K14/00;C07K14/435;C07K16/00;C07K16/18;C12N15/10;C12N15/11;C12N15/12;C12N15/63;C12N15/64;C12P21/00;C12Q1/68;G01N33/68Applicant(s) Name: Shanghai Bode Gene Development Co. Ltd.Address: Inventor(s) Name: Mao Yumin;Xie YiPatent Agency Code: 00000Patent Agent: Abstract The present invention discloses a novel polypeptide-human copper transport protein 9.9, the polynucleotide for coding this polypeptide and a method for producing this polypeptide by using… Read More »

Technological process for producing chromium-zirconium-copper rod material containing oxide dispersed and reinforced copper

Application Number: 00122913Application Date: 2000.08.23Publication Number: 1339613Publication Date: 2002.03.13Priority Information: International: B23K11/00;B23K35/30;C22C1/05;C22C1/10;C22C9/00Applicant(s) Name: Inst. of Metals, Chinese Academy of SciencesAddress: Inventor(s) Name: Min Jiayuan;He Guanhu;Wang BaoquanPatent Agency Code: 21002Patent Agent: zhu guanglinAbstract The present invention relates to one production process of resistive spot welding electrode. Fine copper powder and superfine aluminium oxide powder are mixed… Read More »

Lubricant for high speed drawing of copper pipe and its prepn

Application Number: 00112123Application Date: 2000.03.08Publication Number: 1312357Publication Date: 2001.09.12Priority Information: International: C10M113/04Applicant(s) Name: Gao ZhengzhongAddress: Inventor(s) Name: Gao ZhengzhongPatent Agency Code: 32002Patent Agent: guo fenghaiAbstract The lubricant for drawing copper tube is made of naphthenic lipid, ethylene-propylene copolymer, antioxidant, antiwear agent and anticoagulant agent through a simple preparation method according to a certain mixing ratio.… Read More »

Application of copper tube as bus bridge and insulating sleeve pipe for copper tube passing through wall in transformer station

Application Number: 00117372Application Date: 2000.08.29Publication Number: 1281279Publication Date: 2001.01.24Priority Information: International: H02G3/22;H02G5/02Applicant(s) Name: Luo ZhizhaoAddress: Inventor(s) Name: Luo ZhizhaoPatent Agency Code: 00000Patent Agent: Abstract A new application of copper tube as bus bridge and insulating sleeve pipe for copper pipe passing through wall in transformer station is disclosed. Said capper tube can replace rectangular copper… Read More »

Super thick wall chromium zirconium copper tube for resistance welding holder electrode arm and preparing method

Application Number: 00123257Application Date: 2000.11.15Publication Number: 1351920Publication Date: 2002.06.05Priority Information: International: B21D35/00;B23K11/30Applicant(s) Name: Metal Inst., Chinese Academy of SciencesAddress: Inventor(s) Name: Min Jiayuan;Wang Tiehai;He GuanhuPatent Agency Code: 21002Patent Agent: zhu guanglinAbstract A welding holder electrode arm is made of Cr and Zr-contained copper alloy pipe. The vacuum smelted copper alloy with Cr content of 0.2-0.7… Read More »

Inorganic copper and silver antiseptic

Application Number: 00112290Application Date: 2000.05.16Publication Number: 1323527Publication Date: 2001.11.28Priority Information: International: A01N59/20Applicant(s) Name: Gu HaoAddress: Inventor(s) Name: Gu HaoPatent Agency Code: 00000Patent Agent: Abstract The invention velates to an inorganic antimicrobial adopting hard soluble compound that contains elements of silver or copper such as silver tungstate, silver oxalate, silver thiocyanate, silver bromide, silver iodide, cupric… Read More »

Method and system for recovering and removing copper from fluid

Application Number: 00117945Application Date: 2000.04.07Publication Number: 1278564Publication Date: 2001.01.03Priority Information: 1999/4/7 GB 9907848.7International: C25C1/12;C23F1/46;C25C7/04;C22B15/14;C22B3/20Applicant(s) Name: Shipray Co.Address: Inventor(s) Name: M. T. GushePatent Agency Code: 11038Patent Agent: duan chengenAbstract The invention provides novel processes and apparatus for removal of copper from a solution or fluid, particularly spent etchant solutions that contain copper produced through printed circuit… Read More »

Simple method for wrapping pottery artwork with copper layer

Application Number: 00123424Application Date: 2000.08.16Publication Number: 1338392Publication Date: 2002.03.06Priority Information: International: B44D5/00;B44F9/10Applicant(s) Name: Xue FaweiAddress: Inventor(s) Name: Xue FaweiPatent Agency Code: 00000Patent Agent: Abstract A process for coating copper layer on the surface of pottery artwork includes such steps as mixing carp glue with copper powder, spraying the mixture on the surface of raw pottery… Read More »

Method and equipment for preparing yellow Dumet wire made of copper alloy

Application Number: 00112365Application Date: 2000.06.30Publication Number: 1278017Publication Date: 2000.12.27Priority Information: International: C22F1/08Applicant(s) Name: Tan WenhuaAddress: Inventor(s) Name: Tan WenhuaPatent Agency Code: 32208Patent Agent: shi jianqunAbstract The present invention relates to a preparation method of Domet wire and the improvement of its device. It changes controlles oxidation into controlled oxidation, to make the annelaing of Domet… Read More »

Electrodeposit copper foil and its mfg method, copper coated laminate and PC board

Application Number: 00118195Application Date: 2000.06.08Publication Number: 1276442Publication Date: 2000.12.13Priority Information: 2000/4/14 JP 113655/00; 1999/6/8 JP 161644/99International: C25D1/04Applicant(s) Name: Mitsui Mining & Smelting Co., Ltd.Address: Inventor(s) Name: Imada Nobuyuki;Hirasawa Hiroshi;Koge YasujiPatent Agency Code: 31100Patent Agent: zhou chengzeAbstract A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate… Read More »

Wet process for treating copper or arsenic sulfide

Application Number: 00124881Application Date: 2000.09.21Publication Number: 1343623Publication Date: 2002.04.10Priority Information: International: C01G3/10Applicant(s) Name: Huaxin Metal Co Ltd, Guixi SmelteryAddress: Inventor(s) Name: LIu Changyong;Wu Wei;Zeng XiaodongPatent Agency Code: 00000Patent Agent: Abstract A process for preparing copper sulfate from the sulfide containing copper and arsenic includes mixing the said sulfide with 2-valence iron ions and compressed air… Read More »

Making process of high-strength redox copper powder

Application Number: 00113442Application Date: 2000.05.19Publication Number: 1324703Publication Date: 2001.12.05Priority Information: International: B22F9/00Applicant(s) Name: Zhenghong Feed Co., Ltd., HunanAddress: Inventor(s) Name: Li Chunyu;Zhu Huicong;Zhang YiqingPatent Agency Code: 00000Patent Agent: Abstract The production method of high strength copper powder includes the following steps: atomizing electrolytic copper to obtain copper powder, sintering to form block under the oxidation… Read More »

Copper foil for printed-circuit board

Application Number: 00118487Application Date: 2000.05.25Publication Number: 1275880Publication Date: 2000.12.06Priority Information: 1999/5/25 JP 145620/99International: H05K1/09;H05K3/38Applicant(s) Name: Mitsui Mining Smelting Co., Ltd.Address: Inventor(s) Name: Takahashi Naoomi;Umaba Senyoichi;Higuchi TsutomuPatent Agency Code: 72001Patent Agent: lu xinhuaAbstract A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed… Read More »

Stainless steel plate with enriched copper crystal and/or copper coagulated layer dispersed in substrate

Application Number: 00124883Application Date: 2000.09.21Publication Number: 1290766Publication Date: 2001.04.11Priority Information: 2000/3/2 JP 056700/00; 2000/3/30 JP 094837/00; 1999/9/21 JP 266607/99International: C21D1/26;C22C38/20;C22C38/42;C23G1/02Applicant(s) Name: Nisshin Steel Co., Ltd.Address: Inventor(s) Name: Hiromatsu Naoudo;Nakamura Sadataka;KagokaPatent Agency Code: 11216Patent Agent: liu jiyangAbstract A new stainless steel sheet has a stainless steel substrate which contains Cu at a ratio of 1.0 wt.… Read More »

Process for modifying atomized copper powder by oxidization

Application Number: 00113456Application Date: 2000.05.26Publication Number: 1320560Publication Date: 2001.11.07Priority Information: International: C01G3/02Applicant(s) Name: Li GuoshengAddress: Inventor(s) Name: Li Guosheng;Yi QiongPatent Agency Code: 43113Patent Agent: tang guobengAbstract A process for modifying the atomized copper powder by oxidization includes loading the bulk copper powder in boat or on conveying belt and oxidizing at 450-750 deg.C, and features… Read More »

White copper alloy material not containing nickel

Application Number: 00118731Application Date: 2000.06.16Publication Number: 1278561Publication Date: 2001.01.03Priority Information: 1999/6/17 JP 171164/99International: C22C9/05Applicant(s) Name: YKK Co., Ltd.Address: Inventor(s) Name: Sugimoo Hohiko;Yoshimura Taiji;Kita KazuhikoPatent Agency Code: 31100Patent Agent: liu libengAbstract A nickel-free white copper alloy material, wherein a white coating layer containing no Ni is formed on a base material composed of an alloy represented… Read More »