Tag Archives: epoxy

Epoxy resin composition and semiconductor device

Application Number  00129271 Application Date  2000.09.30 Publication Number  1345896 Publication Date  2002.04.24 Priority Information     International Classification  C08L63/00;H01L23/28   Applicant(s) Name  Sumitomo Bakelite Co., Ltd.   Address     Inventor(s) Name  Ota Ken   Patent Agency Code  11038 Patent Agent  chen cuan AbstractThe epoxy resin composition with excellent forming property, fire-resisting property, low water… Read More »

Epoxy resin composition and semiconductor device

Application Number  00129270 Application Date  2000.09.30 Publication Number  1346150 Publication Date  2002.04.24 Priority Information     International Classification  C08L63/00;H01L23/29   Applicant(s) Name  Sumitomo Bakelite Co., Ltd.   Address     Inventor(s) Name  Kaiga Fumihiro   Patent Agency Code  11038 Patent Agent  chen cuan AbstractThe present invention discloses to an epoxy resin composition containing no bromide… Read More »

Solidifying agent of epoxy resin

Application Number: 00126748Application Date: 2000.12.21Publication Number: 1298913Publication Date: 2001.06.13Priority Information: International: C08K5/17;C09J163/00Applicant(s) Name: Li ZijianAddress: Inventor(s) Name: Li ZijianPatent Agency Code: 43108Patent Agent: zhang hanqinAbstract An epoxide resin curing agent is made up by compounding phenol, formaldehyde, ethylenediamine, para tert butyl phenol, n-butanol glycidylaether, polypropanediolglycidyl ether etc as raw material ingredients in a certain proportion.… Read More »

Room temperature solidified filling and sealing epoxy material

Application Number: 00117123Application Date: 2000.06.02Publication Number: 1327021Publication Date: 2001.12.19Priority Information: International: C09K3/10Applicant(s) Name: Qingtian Paint Chemical Industry Co., Ltd., GuangzhouAddress: Inventor(s) Name: Li XiongweiPatent Agency Code: 44104Patent Agent: guan jiaqiangAbstract The room temperature solidified filling and sealing epoxy material consists of epoxy resin, additives, curing agent, fireproof agent and other assistant, and it is packed… Read More »

Epoxy resin composite containing compound inorganic stuffing

Application Number: 00122861Application Date: 2000.08.30Publication Number: 1288914Publication Date: 2001.03.28Priority Information: International: C08K3/00;C08L63/00Applicant(s) Name: Inst. of Chemistry, Chinese Academy of ScienceAddress: Inventor(s) Name: Liu Xin;Zhou Wei;Li GangPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract The epoxy resin composite includes (weight portion) 100 portions of epoxy resin, 20-80 portions of solidifying agent phenolic resin, 1-5 portions of solidification… Read More »

Epoxy resin composite containing organosilicon modifier

Application Number: 00122862Application Date: 2000.08.30Publication Number: 1288915Publication Date: 2001.03.28Priority Information: International: C08K5/54;C08L63/00Applicant(s) Name: Inst. of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Zhou Wei;Liu Xin;Li GangPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract The epoxy resin composite includes epoxy resin, solidifying agent phenolic resin, solidification accelerating agent, inorganic filler and organic silicon modifying agent, in which… Read More »

Epoxy polyamine flocculant produced by using adipamine residue

Application Number: 00110623Application Date: 2000.07.06Publication Number: 1290658Publication Date: 2001.04.11Priority Information: International: B01D21/01;C02F1/56Applicant(s) Name: Environment Protection Monitory Station, Shenyang Economic and Technological DevAddress: Inventor(s) Name: Wang Zhencheng;Liu Yi;Jia CunmeiPatent Agency Code: 21116Patent Agent: yu feiAbstract Epoxy polyamine flocculant as a kind of chemical product is suitable for use in sewage treatment in medicine, chemical, papermaking, printing… Read More »

Resin composition with phosphorous compound having epoxy radical and its use

Application Number: 00123523Application Date: 2000.08.18Publication Number: 1339537Publication Date: 2002.03.13Priority Information: International: B32B27/38;C08K5/49;C08L85/00;C09D163/00;H05K1/03Applicant(s) Name: Changchun Artificial Resin Plant Co., Ltd.Address: Inventor(s) Name: Huang Kunyuan;Chen Hongxing;Du AnbangPatent Agency Code: 72003Patent Agent: yang shuyuanAbstract The novel resin composite includes: a kind of phosphorous compound with epoxy radical; and a kind of phosphorous curing agent with substitute group capable… Read More »

Process for preparing epoxy modified acrylic acid-polyurethane emulsion and water-soluble polyurethane paint

Application Number: 00111085Application Date: 2000.04.27Publication Number: 1320669Publication Date: 2001.11.07Priority Information: International: C09D175/04Applicant(s) Name: Shandong Polytechnical UnivAddress: Inventor(s) Name: Wu Youshi;Shi Yuanchang;Wu SiPatent Agency Code: 37205Patent Agent: geng qiangzhangAbstract An epoxy modified acrylic acid-polyurethane emulsion is prepared through the copolymerization of the hydroxy-containing compound (polyester or polyether, triglycol, epoxy resin, hydroxyethyl acrylate, or DMPA) with isocyanate-containing… Read More »

Fire-retarded epoxy resin composition, its preparing method and use

Application Number: 00123527Application Date: 2000.08.18Publication Number: 1339534Publication Date: 2002.03.13Priority Information: International: C08K9/00;C08K3/22;C08L63/00Applicant(s) Name: Changchun Artificial Resin Plant Co., Ltd.Address: Inventor(s) Name: Huang Kunyuan;Chen HongxingPatent Agency Code: 72003Patent Agent: yang shuyuanAbstract The fire retardant epoxy resin composite consists of epoxy resin, curing agent and metal hydrate as inorganic filler coated by the epoxy resin, and contains… Read More »

Epoxy glass mica powder band with high mica content

Application Number: 00112731Application Date: 2000.03.07Publication Number: 1265511Publication Date: 2000.09.06Priority Information: International: H01B3/04;H01B17/00;H02K3/30Applicant(s) Name: Sichuan Dongfang Insulating Material Co., Ltd.Address: Inventor(s) Name: Wu Shanghua;Chen Guanrong;Liu QunPatent Agency Code: 51103Patent Agent: yang yinmaoAbstract The epoxy glass mica band consists of electric base-less glass fabric layer, 120-170 g/sq m mica paper layer and adhesive layer and the adhesive… Read More »

Liquid epoxy composite for packaging semiconductor and its application

Application Number: 00123621Application Date: 2000.08.25Publication Number: 1282105Publication Date: 2001.01.31Priority Information: International: C08L63/00;C09K3/10;H01L23/29Applicant(s) Name: Inst. of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Wang Zhonggang;Xie Meiran;Tao ZhiqiangPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract The present invention discloses a liquid epoxy resin composite for packaging semiconductor, including (by weight portion) 100 portions of liquid epoxy resin, 65-165… Read More »

Preparation of cyclohexannoe-lower aldehyde epoxy resin

Application Number: 00113383Application Date: 2000.04.20Publication Number: 1269375Publication Date: 2000.10.11Priority Information: International: C08G81/00Applicant(s) Name: Yueyang Petrochemical Plant, Baling Petrochemical Corp.Address: Inventor(s) Name: Yu Weixun;Peng Xiaoping;Mao ShunliPatent Agency Code: 43103Patent Agent: wang mengshuAbstract The present invention discloses a preparation method for cyclohexanone low-grade aldehydes epoxy resin which uses cyclohexanone low-grade aldehyde resin and epoxy resin as raw… Read More »

Low-viscosity liquid alicyclic epoxy compound and its preparing process

Application Number: 00123735Application Date: 2000.09.01Publication Number: 1340506Publication Date: 2002.03.20Priority Information: International: C07D307/00Applicant(s) Name: Inst of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Wang Zhonggang;Xie MeiranPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract A low-viscosity liquid alicyclic epoxy compound for the packaging of ICs is prepared through coupling halocycloolefine to obtain alicyclic diolefin, etherifying reaction of alicyclic… Read More »

Process for directly synthesizing 2-(4-p-tert-buty/penoxyl) cyclohexanol from epoxy cyclohexane component in light oil as by-product of oxidining cyclohexane

Application Number: 00113506Application Date: 2000.06.27Publication Number: 1331068Publication Date: 2002.01.16Priority Information: International: C07C41/02;C07C43/23Applicant(s) Name: Changde Chemical Industry Co Ltd, Yueyang CityAddress: Inventor(s) Name: Zhou Tianhong;Zheng Shouping;Liu QianwenPatent Agency Code: 00000Patent Agent: Abstract A process for directly synthesizing 2-(4-p-tert-butylphenoxyl) cyclohexanol (the intermediate of propargite) from the epoxy cyclohexane contained in light oil as the by-product of cyclohexane… Read More »

Liquid alicyclic epoxy compound with biepoxy function group and its preparing process

Application Number: 00123736Application Date: 2000.09.01Publication Number: 1340501Publication Date: 2002.03.20Priority Information: International: C07D303/04Applicant(s) Name: Inst of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Wang Zhonggang;Xie MeiranPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract A liquid alicyclic epoxy compound with biepoxy function group is prepared through etherifying reaction of alicyclic olefin alkoxide an halocycloolefin and further epoxidizing reaction.… Read More »

Polyetherimide modified epoxy resin

Application Number: 00114942Application Date: 2000.03.14Publication Number: 1263909Publication Date: 2000.08.23Priority Information: International: C08L63/00;C08L79/08Applicant(s) Name: Fudan Univ.Address: Inventor(s) Name: Li Shanjun;Cui Jun;Tang XiaolinPatent Agency Code: 31200Patent Agent: yao jingfangAbstract A process for preparing the polyetherimide modified epoxy resin by mixing method featurs that 5-45 Phr of polyetherimide and 20-60 Phr of solidifying agent are added to epoxy… Read More »

Refractory liquid alicyclic epoxy compound and its preparing process

Application Number: 00123737Application Date: 2000.09.01Publication Number: 1340504Publication Date: 2002.03.20Priority Information: International: C07D303/04Applicant(s) Name: Inst of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Wang Zhonggang;Xie MeiranPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract A heat-resistant liquid alicyclic epoxy compound for the packaging of ICs is prepared through etherifying reaction of alicyclic alkenediol with halocycloolefin to form alicyclic… Read More »

Process for preparing epoxy cedrane from China fir oil as raw material

Application Number: 00116607Application Date: 2000.06.15Publication Number: 1283618Publication Date: 2001.02.14Priority Information: International: C07D301/00;C07D303/06Applicant(s) Name: Fudan Univ.Address: Inventor(s) Name: Tao Fenggang;Lu Wencong;Ding ZongbiaoPatent Agency Code: 31200Patent Agent: lu feiAbstract A process for preparing epoxy cedrane from China fir oil includes isoforming, fractionating to obtain cedrene, preparing epoxidizing reagent in-situ from inorganic peroxide and acetic acid anhydride, epoxidizing… Read More »

Diazo coupling process of polymer to synthesize high molecular epoxy resin dye

Application Number: 00124423Application Date: 2000.09.01Publication Number: 1284524Publication Date: 2001.02.21Priority Information: International: C09B69/10Applicant(s) Name: Qinghua Univ.Address: Inventor(s) Name: Wang XiaogongPatent Agency Code: 11201Patent Agent: luo wenqunAbstract The diazo coupling process includes the first preparation of primary epoxy resin polymer, the second preparation of diazo salt with aromatic amino compound, and the final diazo coupling reaction of… Read More »

Dual-component structural adhesive of epoxy resin for buildings

Application Number: 00116709Application Date: 2000.06.23Publication Number: 1282771Publication Date: 2001.02.07Priority Information: International: C09J163/00Applicant(s) Name: Zhijiang Organosilicon Chemical Co., Ltd., HangzhouAddress: Inventor(s) Name: He Yongfu;Ni Hongzhi;Hua LishanPatent Agency Code: 33100Patent Agent: xu guanshouAbstract A dual-component structural adhesive of epoxy resin for building contains components A and B. Said component A contains bisphenol A type epoxy resin and… Read More »

Addition cross-linked epoxy functional organo-siloxanes polymer and coating composition

Application Number: 00109421Application Date: 2000.06.23Publication Number: 1279250Publication Date: 2001.01.10Priority Information: 1999/6/24 US 09/339,141International: C08G77/14;C09D183/14Applicant(s) Name: Wacker-chemie GmbHAddress: Inventor(s) Name: J. D. GerlingPatent Agency Code: 72002Patent Agent: gan lingAbstract The present invention relates to an epoxy-functional organopolysiloxane resin, which is prepared by reaction of polysiloxane resin and silane each with an epoxy group. The epoxy-functional organopolysiloxane… Read More »

Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated

Application Number: 00108762Application Date: 1995.08.29Publication Number: 1284520Publication Date: 2001.02.21Priority Information: 1995/1/30 JP 012437/1995; 1995/2/2 JP 016183/1995; 1994/8/30 JP 205175/1994; 1994/9/27 JP 231182/1994International: C08K5/138;C08L63/00Applicant(s) Name: Sumitomo Chemical Co., Ltd.Address: Inventor(s) Name: Ageta Yoichi;Endo Yasuhiro;Shibata MitsuhiroPatent Agency Code: 11038Patent Agent: chen jizhuangAbstract The invention relates to an aryl ester compound, which is used as a curing agent… Read More »

Flame-retarding non-halogen non-phosphorus epoxy resin composition

Application Number: 00108056Application Date: 2000.06.08Publication Number: 1328088Publication Date: 2001.12.26Priority Information: International: C08K9/06;C08L63/00Applicant(s) Name: Industrial Technology InstAddress: Inventor(s) Name: Li Mingxi;Kang Qingju;Peng GuilanPatent Agency Code: 72003Patent Agent: yang shuyuanAbstract A flame-retarding non-halogen non-phosphorus epoxy resin composition is prepared from epoxy resin (100 wt. portions), phenolic resin solidifying agent (40-60) and flame retardant as the mixture of… Read More »

Epoxy resin solidified microsphere water-base system and its preparation method

Application Number: 00107216Application Date: 2000.04.28Publication Number: 1321694Publication Date: 2001.11.14Priority Information: International: C08G59/18;C08L63/00Applicant(s) Name: Inst. of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Yang Zhenzhong;Zhu Yan;Xu JianjunPatent Agency Code: 00000Patent Agent: Abstract The present invention relates to an epoxy resin solidification microsphere water base system, in the system the weight ratio of epoxy resin solidification microsphere… Read More »

Epoxy resin/microparticle composite solidified microsphere water base system and its preparation method

Application Number: 00107215Application Date: 2000.04.28Publication Number: 1321697Publication Date: 2001.11.14Priority Information: International: C08J3/03;C08L63/04Applicant(s) Name: Inst. of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Yang Zhenzhong;Zhu Yan;Xu JianjunPatent Agency Code: 00000Patent Agent: Abstract The present invention relates to an epoxy resin/particle composite solidification microsphere water base system, in the system the weight ratio of epoxy resin/particle composite… Read More »

Phenol-amino condensation resin, preparing method, epoxy resin composition, prepreg and laminated board thereof

Application Number: 00101905Application Date: 2000.01.28Publication Number: 1266859Publication Date: 2000.09.20Priority Information: 1999/1/29 JP 20928/99; 1999/10/18 JP 295244/99International: B32B31/14;C08G14/10;C08L63/04Applicant(s) Name: Hitachi Kasei Industrial Co., Ltd.Address: Inventor(s) Name: Adachi Hiroshi;Oshima Kiyoshi;Iue YoshikiPatent Agency Code: 31100Patent Agent: zhang mingyuAbstract To provide a phenol-amino condensation resin excellent in heat resistance, water resistance, flame retardancy, mechanical strengths, curability, etc., and an… Read More »

Phenyl heterocyclic compound used as epoxy enzyme -2 inhibitor

Application Number: 00100981Application Date: 2000.01.12Publication Number: 1295065Publication Date: 2001.05.16Priority Information: 1993/6/24 US 082196; 1994/1/10 US 179467International: C07C313/04;C07C317/24Applicant(s) Name: McFrost (Canada) Co.Address: Inventor(s) Name: Y. Ducharmy;J.Y. Gautie;P. PrasiePatent Agency Code: 72001Patent Agent: wen hongyanAbstract The invention discloses compound of formula A, wherein R1 is selected form: (a) S(O)2CH3, (b) S(O)2NH2; R2 is selected from substituted or… Read More »

Water epoxy priming coating agent and its preparation method

Application Number: 00100092Application Date: 2000.01.07Publication Number: 1303896Publication Date: 2001.07.18Priority Information: International: C09D163/00Applicant(s) Name: Zhai RunAddress: Inventor(s) Name: Zhai Run;Zhai YoufuPatent Agency Code: 00000Patent Agent: Abstract The present invention relates to a water-base epoxy primer coating agent and its preparation method. It is mainly composed of water soluble epoxy rein (greater than 98%), polyacrylic emulsion (solid… Read More »